MOUNTING ARRANGEMENT AND METHOD FOR LIGHT EMITTING DIODES

• US 20100087118A1
• Filed: 09/29/2009
• Published: 04/08/2010
• Est. Priority Date: 10/19/1999
• Status: Active Grant

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Honegger, Gregory W., Popovich, John
• Granted Patent: US 8,186,850 B2
• Time in Patent Office: Days
• US Class Current: 445/23
• CPC Class Codes: A47C 7/725 for illumination, e.g. lamps
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 7/0025 Combination of two or more reflectors for a single light source array of reflectors for a cluster of light sources F21V7/0083
• CPC Class Codes: F21V 7/005 with an elongated shape to cooperate with linear light sources
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10S 362/80 : Light emitting diode
• CPC Class Codes: Y10T 29/49133 : with component orienting
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Claims

1. A method for making an illumination apparatus, comprising:

providing a plurality of lighting modules, each lighting module comprising;

at least one light emitting diode (LED) package comprising a lens, the LED package adapted to direct light in a direction in which the lens is facing;

a circuit board comprising a mounting face having a generally planar portion; and

plural electrically-conductive contacts on the mounting face of the circuit board, the contacts being configured to mount the at least one LED package such that the at least one LED package is electrically connected to the contacts and the lens faces a direction generally coplanar to the planar portion of the mounting face;

providing a housing comprising a first wall, a second wall, and a third wall that cooperate to define a channel having an opening;

arranging the lighting modules on the first wall of the housing so that the lenses of the LED packages do not face the opening; and

attaching the lighting modules as arranged on the first wall.

2. The method of claim 1 additionally comprising arranging the lighting modules so that at least one of the LED packages faces the second wall of the housing.

3. The method of claim 2, wherein all of the LED package lenses of each lighting module face in the same general direction.

4. The method of claim 1, wherein arranging the lighting modules comprises arranging the lighting modules so that the lenses of the LED packages face generally away from the opening.

5. The method of claim 1, wherein all of the LED package lenses of each lighting module face in the same general direction.

6. The method of claim 1, wherein attaching the lighting module comprises adhering the lighting module circuit board to the housing wall.

7. The method of claim 6, comprising using tape to adhere the lighting module circuit board to the housing wall.

8. The method of claim 1, comprising arranging the lighting modules so that each LED package lens faces one or more of the first, second and third walls so that light from the LED bounces off of at least one of the walls before passing through the opening.

9. The method of claim 8, wherein each LED module circuit board comprises a dielectric and a heat conductive body, the dielectric having first and second sides, the dielectric being on the first side of the circuit board, the contacts being attached to the first side of the dielectric, and the heat conductive body being connected to the second side of the dielectric so that heat from the LED flows through the dielectric and to the heat conductive body.

10. The method of claim 9, wherein providing the housing comprises providing the first wall made of a heat-conductive material so that the first wall is configured to function as a heat sink, so that heat from the at least one LED flows through the dielectric to the heat conductive body and to the first wall.

11. The method of claim 1 additionally comprising fitting a light-diffusing lens over the channel opening.