ASHING APPARATUS

• US 20100089533A1
• Filed: 12/26/2007
• Published: 04/15/2010
• Est. Priority Date: 08/16/2007
• Status: Active Grant

• Current Assignee: Ulvac Incorporated
• Original Assignee: Ulvac Incorporated
• Inventors: Suu, Koukou, Ishikawa, Michio, Yogo, Toshiya, Kurimoto, Takashi, Ueda, Masahisa
• Granted Patent: US 9,059,105 B2
• Time in Patent Office: Days
• US Class Current: 156/345.330
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01L 21/31138 by dry-etching

Abstract

Disclosed is an ashing apparatus wherein decrease in processing efficiency is suppressed. Specifically, a shower plate is arranged to face a substrate stage on which a substrate is placed, and diffuses oxygen radicals supplied into a chamber. A metal blocking plate is arranged between the shower plate and the substrate stage and has a through hole through which oxygen radicals pass. In addition, the metal blocking plate has a first layer, which is made of a metal same as the one exposed in the substrate, on the surface facing the substrate.

Claims

1. An ashing device for ashing organic material on a substrate including an exposed metal in a processing chamber, the ashing device comprising:

a stage which holds the substrate;

a diffuser plate facing toward the stage which diffuses active species supplied to the processing chamber and includes first through holes through which the active species pass; and

a porous plate arranged between the stage and the diffuser plate, in which the porous plate includes a first layer, facing toward the substrate and formed from the same metal as the exposed metal on the substrate, and second through holes, through which the active species pass;

wherein the stage is connected to a high frequency power supply which applies a high frequency bias; and

the porous plate is connected to the processing chamber to function as an opposite electrode of the stage.

2. The ashing device according to claim 1, further comprising:

a cylindrical diffusion prevention wall which includes a lower end opening and extends around the diffuser plate to prevent unnecessary diffusion of the active species;

wherein the porous plate is attached in a removable manner to the diffusion prevention wall to cover the lower end opening.

3. The ashing device according to claim 1, wherein:

the processing chamber includes an upper inner surface to which the diffuser plate is fixed; and

the porous plate located at a position lower than a middle position between the upper inner surface of the processing chamber and the stage.

4. The ashing device according to claim 1, wherein the second through holes of the porous plate are formed to have an aspect ratio greater than or equal to 0.5 and less than or equal to 2, the aspect ratio representing the ratio of a plate thickness of the porous plate and a hole diameter of the second through hole.

6. The ashing device according to claim 1, wherein the porous plate further includes a passivation film facing toward the diffuser plate.

7. The ashing device according to claim 6, wherein the porous plate includes:

a metal plate formed from the same metal as the exposed metal and functioning as the first layer facing toward the substrate; and

a fluoride layer formed on the metal plate and functioning as the passivation film facing toward the diffuser plate.

8. The ashing device according to claim 6, wherein the porous plate includes:

a metal plate formed from the same metal as the exposed metal and functioning as the first layer facing toward the substrate;

a metal oxide layer formed on the metal plate; and

a fluoride layer formed on the metal oxide layer and functioning as the passivation film facing toward the diffuser plate.

9. The ashing device according to claim 6, wherein the porous plate includes:

a metal base plate;

a metal film formed on the metal base plate from the same metal as the exposed metal and functioning as the first layer facing toward the substrate; and

a fluoride layer formed on the metal base plate and functioning as the passivation film facing toward the diffuser plate.

10. The ashing device according to claim 6, wherein the porous plate includes:

a metal base plate;

a metal film formed on the metal base plate from the same metal as the exposed metal and functioning as the first layer facing toward the substrate;

a metal oxide layer formed on the metal base plate; and

a fluoride layer, formed on the metal oxide layer, functioning as the passivation film facing toward the diffuser plate.

11. The ashing device according to claim 6, wherein the passivation film includes a metal oxide layer.

12. The ashing device according to claim 6, wherein the porous plate includes:

a metal base plate;

a metal film, formed on the metal base plate from the same metal as the exposed metal and functioning as the first layer facing toward the substrate; and

a metal oxide layer formed on the metal base plate and functioning as the passivation film facing toward the diffuser plate.

13. The ashing device according to claim 8, wherein the metal oxide layer is formed from an aluminum oxide or ittria.

14. The ashing device according to claim 2, wherein:

the processing chamber includes an upper inner surface to which the diffuser plate is fixed; and

the porous plate located at a position lower than a middle position between the upper inner surface of the processing chamber and the stage.

15. The ashing device according to claim 14, wherein the second through holes of the porous plate are formed to have an aspect ratio greater than or equal to 0.5 and less than or equal to 2, the aspect ratio representing the ratio of a plate thickness of the porous plate and a hole diameter of the second through hole.

16. The ashing device according to claim 15, wherein the porous plate further includes a passivation film facing toward the diffuser plate.

17. The ashing device according to claim 2, wherein the second through holes of the porous plate are formed to have an aspect ratio greater than or equal to 0.5 and less than or equal to 2, the aspect ratio representing the ratio of a plate thickness of the porous plate and a hole diameter of the second through hole.

18. The ashing device according to claim 2, wherein the porous plate further includes a passivation film facing toward the diffuser plate.

19. The ashing device according to claim 10, wherein the metal oxide layer is formed from an aluminum oxide or ittria.

20. The ashing device according to claim 11, wherein the metal oxide layer is formed from an aluminum oxide or ittria.

21. The ashing device according to claim 12, wherein the metal oxide layer is formed from an aluminum oxide or ittria.

5. (canceled)