Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids

• US 20100089553A1
• Filed: 10/15/2008
• Published: 04/15/2010
• Est. Priority Date: 10/15/2008
• Status: Active Grant

• Current Assignee: Tai-Her Yang
• Original Assignee: Tai-Her Yang
• Inventors: Yang, Tai-Her
• Granted Patent: US 8,297,343 B2
• Time in Patent Office: Days
• US Class Current: 165/104.190
• CPC Class Codes: F24D 3/122 Details
• CPC Class Codes: F25B 2339/00 Details of evaporators; Details of condensers
• CPC Class Codes: F28D 1/047 the conduits being bent, e.g. in a serpentine or zig-zag
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 7/08 the conduits being otherwise bent, e.g. in a serpentine or zig-zag F28D7/10 takes precedenceF28D7/0016 and F28D7/0033 take precedence
• CPC Class Codes: F28F 1/24 and extending transversely F28F1/38 takes precedence
• CPC Class Codes: F28F 2210/02 with particular branching, e.g. fractal conduit arrangements
• CPC Class Codes: F28F 2210/10 Particular layout, e.g. for uniform temperature distribution
• CPC Class Codes: F28F 2250/10 Particular pattern of flow of the heat exchange media
• CPC Class Codes: Y02B 30/00 Energy efficient heating, ventilation or air conditioning [HVAC]

Abstract

The present invention discloses that the thermal conductive fluids in temperature difference are reversely transported by the first fluid piping and second fluid piping in parallel or quasi-parallel arrangement on the same end side to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the heat absorbing or dissipating body (100) or the passively heat dissipation or absorption receiving article or space (200).

Claims

1. A heat absorbing or dissipating device by using multi-pipe to pass the thermal conductive fluids in reverse directions as the heat absorbing or dissipating body, more specifically it is disposed with at least one passage of the first fluid piping and at least one passage of the second fluid piping in parallel or quasi-parallel arrangement, wherein the first fluid piping and the second fluid piping is arranged for transporting the thermal conductive fluids constituted by gaseous or liquid state fluid, gaseous to liquid state fluid or liquid to gaseous state fluid in temperature difference to the passively heat dissipation or absorption receiving article or space in mutually reverse directions, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.

2. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein it mainly comprises the following:

The heat absorbing or dissipating body (100);

it is the heat absorbing or dissipating structural body made of thermal conductive material in solid, or colloid, or liquid, or gaseous state for receiving the thermal energy of the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid inside the combined first fluid piping (101) and the second fluid piping (102) so as to perform heat absorbing cooling energy discharge operating function or heat dissipating warming energy discharge operating-function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200), wherein the number of the heat absorbing or dissipating bodies (100) can be one or more than one;

The first fluid piping (101), the second fluid piping (102);

it is made of good thermal conductive material for reversely passing the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid for transferring thermal energy to the heat absorbing or dissipating body (100) made of good thermal conductive material in solid, or colloid, or liquid, or gaseous state, and the first fluid piping (101) and the second fluid piping (102) can be respectively constituted by one or more than one passage;

The first fluid inlet (111) of said first fluid piping (101) is parallel connected with the second fluid inlet (121) of said second fluid piping (102) to receive the inflow of the thermal conductive fluid (110) and the first fluid outlet (112) of said first fluid piping (101) is parallel connected with the second fluid outlet (122) of said second fluid piping (102) to receive the outflow of the thermal conductive fluid (110);

Said first fluid piping (101) and said second fluid piping (102) are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating body (100), and it is characterized by that the first fluid inlet (111) and the second fluid outlet (122) are installed at the location adjacent to the heat absorbing or dissipating body (100), while the first fluid outlet (112) and the second fluid inlet (121) are installed on another location adjacent to the heat absorbing or dissipating body (100) thereby the thermal conductive fluids (110) in two circuits inside the first fluid piping (101) and the second fluid piping (102) being installed on the heat absorbing or dissipating body (100) are respectively transported in reverse directions to commonly allow the whole temperature difference of the heat absorbing or dissipating body (100) more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200).

3. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the structural relationships between the heat absorbing or dissipating body (100), the first fluid piping (101), and the second fluid piping (102) as shown in FIG. 4 can be constituted by one or more than one relationships as following, include:

(1) The heat absorbing or dissipating body (100) is in a assembled structure with at least one of the first fluid piping (101) and the second fluid piping (102);

or

(2) The heat absorbing or dissipating body (100) is in an integral structure with at least one of the first fluid piping (101) and the second fluid piping (102);

or

(3) The function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102), so as to absorb or dissipate heat onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) without disposing the heat absorbing or dissipating body (100).

4. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the first fluid piping (101) and the second fluid piping (102) can be parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to directly constitute structural body, thereby the first fluid piping (101) and the second fluid piping (102) is arranged to directly reversely transport the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid in temperature difference from the same end side thereby allowing the first fluid piping (101) and the second fluid piping (102) to directly perform heat dissipating warming energy discharge or heat absorbing cooling energy discharge on the passively heat dissipating or absorption receiving article or space;

it is constituted by the following;

The first fluid piping (101) and the second fluid piping (102);

They are made of good thermal conductive material to constitute the common structural body for transferring thermal energy through the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), wherein the first fluid piping (101) and the second fluid piping (102) can be respectively constituted by one or more than one circuits;

the first fluid inlet (111) of said first fluid piping (101) is parallel connected with the second fluid inlet (121) of said second fluid piping (102) to receive inflow of the thermal conductive fluid (110), and the first fluid outlet (112) of said first fluid piping (101) is parallel connected with the second fluid outlet (122) of said second fluid piping (102) to receive outflow of the thermal conductive fluid (110), while the first fluid piping (101) and the second fluid piping (102) the first fluid piping (101) and the second fluid piping (102)appear in parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to constitute the common structural body, wherein it is characterized by that the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed at the location adjacent to their common structural body, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed on the another location adjacent to their common structural body, thereby for the first fluid piping (101) and the second fluid piping (102) in the multiple pipes of the common structural body to transport two circuits of the thermal conductive fluid flows (110) respectively in reverse directions thereby making the whole temperature difference of their common structural body more uniformly distributed in the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).

5. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the structural relationships between the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), the first fluid piping (101) and the second fluid piping (102) include the following:

the function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), or to further use the first fluid piping and the second fluid piping that using multi-pipe to reversely transport thermal conductive fluids to directly constitute the common structural body and to directly transfer thermal energy onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).

6. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein one or more than one methods based aforesaid operating principles according to application structural needs and cost considerations can be used to make the following designs, including:

The first fluid piping (101) and the second fluid piping (102) can be constituted by an integral type structure of the piping made directly using the structure of the heat absorbing or dissipating body (100);

The three of first fluid piping (101), second fluid piping (102) and heat absorbing or dissipating body (100) can be constituted by an assembled structure;

or

The heat absorbing or dissipating body (100) for combination with the first fluid piping (101) and the second fluid piping (102) can be constituted by the structural unit of the single structural body in plate, block, or multi-fins shape, or the structural unit assembled by fins, and can be constituted by at least one structural unit.

7. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the three of the heat absorbing or dissipating body (100) constituted by solid, or colloid, or liquid, or gaseous state thermal conductive material, the first fluid piping (101) and the second fluid piping (102) can be partly or all made to various geometric shapes while without changing the principles.

8. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the thermal conductive fluid (110) is constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid.

9. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) can be transported by pumping, evaporation, or heat-cold natural circulation.

10. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the warming or cooling energy is discharged to the liquid state passively heat dissipation or absorption receiving article or space (200) through using the cold-heat natural circulation of fluid in temperature difference or forced fluid pumping to generate thermal transfer function of heat convention, radiation or conduction;

or the warming or cooling energy is discharged to the solid or colloidal or liquid or gaseous state passively heat dissipation or absorption receiving article or space (200) through conduction.

11. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) is closed-loop circulated or open-loop released.

12. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein it can be applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, heat absorbing cooling energy discharge device using thermal conductive fluid, or heat dissipating warming energy discharge device using thermal conductive fluid such as thermal energy, heater or thermal energy transfer devices for warming equipments, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissipation of frictional heat loss, or heat dissipation or thermal energy transfer of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy transfer of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy transfer of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy transfer of batteries of fuel cells, etc.;

As well as applied for thermal energy transfer in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process.