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Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids

  • US 20100089556A1
  • Filed: 10/14/2009
  • Published: 04/15/2010
  • Est. Priority Date: 10/15/2008
  • Status: Active Grant
First Claim
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1. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, which is a device by passing thermal conductive fluids as heat absorbing or dissipating body, wherein the multiple pipes reversely transport the temperature difference fluids respectively, so as to produce heat absorbing or dissipating function onto passively heat dissipation or absorption receiving article or space thereby the thermal conductive fluids form a more uniform temperature distribution status on the heat absorbing or dissipating body, the main components including:

  • Heat absorbing or dissipating body (100);

    made of thermal conductive material in solid, or colloid, or liquid, or gaseous state for receiving the thermal energy of the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid inside the combined first fluid piping (101) and the second fluid piping (102) so as to perform heat absorbing cooling energy discharge operating function or heat dissipating warming energy discharge operating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200), wherein the number of the heat absorbing or dissipating bodies (100) is one or more than one; and

    First fluid piping (101), Second fluid piping (102);

    made of good thermal conductive material for reversely passing the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid for transferring thermal energy to the heat absorbing or dissipating body (100) made of good thermal conductive material in solid, or colloid, or liquid, or gaseous state, wherein the first fluid piping (101) and the second fluid piping (102) are respectively constituted by one or more than one passage; and

    whereinthe first fluid inlet (111) of the first fluid piping (101) is parallel connected with the second fluid inlet (121) of the second fluid piping (102) to receive the inflow of the thermal conductive fluid (110) and the first fluid outlet (112) of the first fluid piping (101) is parallel connected with the second fluid outlet (122) of the second fluid piping (102) to receive the outflow of the thermal conductive fluid (110); and

    the first fluid piping (101) and the second fluid piping (102) are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating body (100), and it is characterized by that the first fluid inlet (111) and the second fluid outlet (122) are installed at the location adjacent to the heat absorbing or dissipating body (100), while the first fluid outlet (112) and the second fluid inlet (121) are installed on another location adjacent to the heat absorbing or dissipating body (100) thereby the thermal conductive fluids (110) in two circuits inside the first fluid piping (101) and the second fluid piping (102) being installed on the heat absorbing or dissipating body (100) are respectively transported in reverse directions to commonly allow the whole temperature difference of the heat absorbing or dissipating body (100) more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200).

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