FILM STRUCTURE AND ELECTRONIC DEVICE HOUSING UTILIZING THE SAME
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Accused Products
Abstract
An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal films. The metal films are non-continuous with a total thickness of the metal films at a predetermined value. The protective film is deposited onto an upper film of the film stack.
16 Citations
40 Claims
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1-20. -20. (canceled)
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21. A film stack comprising:
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a metal film comprising a plurality of non-continuous layers; and a plurality of dielectric layers alternated with the non-continuous layers; wherein a sum of thicknesses of the non-continuous layers is at a predetermined value. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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28. A film structure comprising:
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an adhesive film configured for adhering the film fixture to a substrate; a film stack deposited on the adhesive film and comprising; a metal film of a predetermined thickness divided into a plurality of non-continuous layers; and a plurality of dielectric layers alternated with the non-continuous layers; and a protective layer deposited on the film stack. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35)
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36. An electronic device housing, comprising:
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a substrate; an adhesive film deposited on the substrate; a film stack adhered to the substrate via the adhesive film, the film stack comprising; a plurality of non-continuous metal films and a plurality of dielectric films alternately formed, a sum of thicknesses of the non-continuous layers is at a predetermined value; and a protective film deposited on the film stack. - View Dependent Claims (37, 38, 39, 40)
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Specification