SEMICONDUCTOR ELEMENT COOLING STRUCTURE

• US 20100090336A1
• Filed: 01/09/2008
• Published: 04/15/2010
• Est. Priority Date: 01/11/2007
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Yoshida, Tadafumi, Yokoi, Yutaka, Osada, Hiroshi
• Granted Patent: US 8,125,078 B2
• Time in Patent Office: Days
• US Class Current: 257/717
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element. A protruded portion for the second semiconductor element is provided to be positioned on the downstream side of first semiconductor element and upstream side than the center of second semiconductor element in the direction of arrow DR1.

Claims

1. A semiconductor element cooling structure, comprising:

a semiconductor element;

a heat sink having a mounting surface on which said semiconductor element is mounted, and having a cooling medium channel formed inside, through which cooling medium for cooling said semiconductor element flows; and

a protruded portion provided at a position opposite to said mounting surface of said heat sink, extending in a direction intersecting a flow direction of said cooling medium, and protruded from a wall surface of said cooling medium channel to the inside of said cooling medium channel;

wherein

said protruded portion is provided close to said semiconductor element and upstream side than the center of said semiconductor element in said flow direction of cooling medium.

2. The semiconductor element cooling structure according to claim 1, further comprising

a second semiconductor element mounted on said mounting surface;

wherein

said semiconductor element and said second semiconductor element are arranged side by side such that said second semiconductor element is positioned on upstream side than said semiconductor element; and

said protruded portion is provided downstream side than said second semiconductor element and upstream side than the center of said semiconductor element in said flow direction of cooling medium.

3. The semiconductor element cooling structure according to claim 1, further comprising

a second protruded portion provided at a position opposite to said protruded portion of said heat sink, extending in a direction intersecting a flow direction of said cooling medium, protruded from a wall surface of said cooling medium channel to the inside of said cooling medium channel and positioned on upstream side of said protruded portion.

4. The semiconductor element cooling structure according to claim 1, wherein

said semiconductor element is included in a controller controlling a rotating electric machine driving a vehicle.

5. A semiconductor element cooling structure, comprising:

a semiconductor element; and

a heat sink having a mounting surface on which said semiconductor element is mounted, and having a cooling medium channel formed inside, through which cooling medium for cooling said semiconductor element flows;

wherein

said heat sink includes a first member including said mounting surface and a second member provided opposite to said first member;

said first member has a plurality of fins formed along said cooling medium channel and protruded from a wall surface of said cooling medium channel to the inside of said cooling medium channel; and

said second member has a protruded portion formed to be fit between said plurality of fins at a part in a longitudinal direction of said fins and protruded from a wall surface of said cooling medium channel to the inside of said cooling medium channel.

6. The semiconductor element cooling structure according to claim 5, wherein

said protruded portion is provided at a position that directs flow of cooling medium flowing through said cooling medium channel to said semiconductor element.

7. The semiconductor element cooling structure according to claim 5, wherein

said semiconductor element is included in a controller controlling a rotating electric machine driving a vehicle.