SHEET-LIKE COMPOSITE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

• US 20100090781A1
• Filed: 09/22/2006
• Published: 04/15/2010
• Est. Priority Date: 09/30/2005
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Yamamoto, Kenichi, Komyoji, Daido, Kuramasu, Keizaburo
• Granted Patent: US 8,058,951 B2
• Time in Patent Office: Days
• US Class Current: 333/167
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence
• CPC Class Codes: H03H 7/175 Series LC in series path H03H7/1783 takes precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09763 Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

To provide a configuration including a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

Claims

1. A sheet-like composite electronic component comprising:

a first sheet substrate, on which a first thin film electronic component is formed on at least one main face and an external connection terminal for connecting to an external circuit is formed on the one main surface or the other main face;

a second sheet substrate, on which a second thin film electronic component is formed on at least one main face; and

an insulating adhesive resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component.

2. The sheet-like composite electronic component according to claim 1, wherein electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component are electrically connected with an interlayer connection conductor.

3. The sheet-like composite electronic component according to claim 1, wherein the first thin film electronic component of the first sheet substrate and the second thin film electronic component of the second sheet substrate have different functions, respectively, and by electrically connecting them, a functional circuit is formed.

4. The sheet-like composite electronic component according to claim 3, wherein a plurality of the functional circuit is provided to be made into a multiple-configuration.

5. The sheet-like composite electronic component according to claim 1, wherein the first thin film electronic component and the second thin film electronic component are any one selected from a group consisting of a capacitor element, an inductor element, a resistor element, a semiconductor thin film functional device and a sensor element.

6. The sheet-like composite electronic component according to claim 3, wherein the first thin film electronic component is a capacitor element, the second thin film electronic component is an inductor element, and the functional circuit is an LC filter circuit.

7. The sheet-like composite electronic component according to claim 3, wherein the first thin film electronic component is a capacitor element, the second thin film electronic component is a resistor element, and the functional circuit is a CR filter circuit.

8. The sheet-like composite electronic component according to claim 1, wherein the first thin film electronic component or the second thin film electronic component is an inductor element, and the insulating adhesive resin layer is made of a material that magnetic powders are dispersed.

9. The sheet-like composite electronic component according to claim 8, wherein, as the insulating adhesive resin layer, a material having much additive amounts of magnetic powders in a region surrounding the inductor element is used.

10. The sheet-like composite electronic component according to claim 1, wherein the external connection terminal is formed at the main face of the first sheet substrate, on which the first thin film electronic component is formed;

at the second sheet substrate, a region corresponding to the external connection terminal is notched, and when the first sheet substrate and the second sheet substrate are adhered and fixed with the insulating adhesive resin layer, the external connection terminal is exposed.

14. The sheet-like composite electronic component according to claim 2, wherein the first thin film electronic component of the first sheet substrate and the second thin film electronic component of the second sheet substrate have different functions, respectively, and by electrically connecting them, a functional circuit is formed.

11. A sheet-like composite electronic component comprising:

a first sheet substrate, on which a first thin film electronic component is formed on at least one main face;

a second sheet substrate, on which a second thin film electronic component is formed on at least one main face; and

a third sheet substrate, on which a third thin film electronic component is formed on at least one main face;

wherein the first sheet substrate and the second sheet substrate, and the first sheet substrate and the third sheet substrate are pasted with each other, and a first thin film electronic component that has been set in advance among a plurality of the first thin film electronic components and the second thin film electronic component, and the first thin film electronic component that has been set in advance and the third thin film electronic component are electrically connected.

12. A method for manufacturing a sheet-like composite electronic component comprising:

forming a plurality of first thin film electronic components on at least one main face of a first resin sheet, and an external connection terminal for connecting to an external circuit on the main face or the other face;

forming a second thin film electronic component on at least one main face of a second resin sheet and on a position corresponding to the first thin film electronic component;

electrically and mechanically connecting an interlayer connection conductor on an electrode terminal, which has been set in advance, of the first thin film electronic component or the second thin film electronic component;

positioning and pressurizing the first thin film electronic component and the second thin film electronic component, electrically connecting respective electrode terminals between the first thin film electronic component and the second thin film electronic component with the interlayer connection conductor, and fixing the first resin sheet and the second resin sheet with an insulating adhesive resin layer; and

cutting the first resin sheet and the second resin sheet to make a composite electronic component.

13. The method for manufacturing a sheet-like composite electronic component according to claim 12, further comprising:

forming the external connection terminal on the main face of the first sheet substrate; and

forming a notched portion on a region corresponding to the external connection terminal on the second resin sheet;

wherein the fixing step is implemented after forming the notched portion.