DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURING METHOD, AND ROOM-TEMPERATURE BONDING APPARATUS
First Claim
Patent Images
1. A device comprising:
- one or more metal elements;
a first substrate;
a second substrate bonded to said first substrate at room temperature through said one or more metal elements,wherein an interface element existence ratio of said metal elements is 0.07 or above.
2 Assignments
0 Petitions
Accused Products
Abstract
An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.
67 Citations
24 Claims
-
1. A device comprising:
-
one or more metal elements; a first substrate; a second substrate bonded to said first substrate at room temperature through said one or more metal elements, wherein an interface element existence ratio of said metal elements is 0.07 or above. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A method of manufacturing a device, comprising:
- performing sputtering on a surface of a first substrate;
attaching one or more metal elements onto the surface of said first substrate; and bonding a second substrate to the surface of said first substrate at room temperature, wherein an interface element existence ratio of said one or more metal elements is 0.07 or above. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
- performing sputtering on a surface of a first substrate;
-
23. A room-temperature bonding apparatus comprising
a vacuum chamber, in which a vacuum atmosphere is generated; -
a substrate holding mechanism configured to hold substrates to be bonded under the vacuum atmosphere; a stage moving mechanism configured to move one of said substrates to a position; a physical sputtering mechanism configured to activate bonding surfaces of said substrates; and a pressure welding mechanism configured to perform a pressure welding process by pressing the activated bonding surfaces to each other, wherein a plurality of metal elements are emitted in a predetermined composition from at least one of structural members and parts of said bonding apparatus, said substrate holding mechanism, said stage moving mechanism, and said pressure welding mechanism disposed in said bonding apparatus through sputtering by said physical sputtering mechanism. - View Dependent Claims (24)
-
Specification