METHOD FOR TEMPERATURE COMPENSATION IN MEMS RESONATORS WITH ISOLATED REGIONS OF DISTINCT MATERIAL
First Claim
1. A method of forming a MEMS resonator comprising:
- forming a first structural material on a substrate;
forming a trench in the first structural material;
forming in the trench, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material; and
patterning a resonator containing both the first and second structural materials.
4 Assignments
0 Petitions
Accused Products
Abstract
MEMS resonators containing a first material and a second material to tailor the resonator'"'"'s temperature coefficient of frequency (TCF). The first material has a different Young'"'"'s modulus temperature coefficient than the second material. In one embodiment, the first material has a negative Young'"'"'s modulus temperature coefficient and the second material has a positive Young'"'"'s modulus temperature coefficient. In one such embodiment, the first material is a semiconductor and the second material is a dielectric. In a further embodiment, the quantity and location of the second material in the resonator is tailored to meet the resonator TCF specifications for a particular application. In an embodiment, the second material is isolated to a region of the resonator proximate to a point of maximum stress within the resonator. In a particular embodiment, the resonator includes a first material with a trench containing the second material.
-
Citations
11 Claims
-
1. A method of forming a MEMS resonator comprising:
-
forming a first structural material on a substrate; forming a trench in the first structural material; forming in the trench, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material; and patterning a resonator containing both the first and second structural materials. - View Dependent Claims (2, 3, 4, 6, 7)
-
-
8. The method of claim 0, further comprising isotropically etching the second structural material to remove the portions of the ring not attached to the sidewall of the resonator.
-
9. A method of forming a MEMS resonator comprising:
-
forming a first structural material on a substrate; patterning the first structural material; forming over the first structural material, a second structural material having a different Young'"'"'s modulus temperature coefficient than the first structural material; planarizing the second structural material to expose the first structural material; and patterning a resonator containing both the first and second structural materials. - View Dependent Claims (5, 10, 11)
-
Specification