METHOD FOR ADJUSTING RESONANCE FREQUENCIES OF A VIBRATING MICROELECTROMECHANICAL DEVICE
First Claim
1. A method for adjusting the resonant frequencies of a vibrating mass comprising the steps of:
- patterning a surface of a device layer of the vibrating mass with a mask;
etching the vibrating mass to define a structure of the vibrating mass;
determining a first set of resonant frequencies of the vibrating mass;
determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass;
removing the mask at the mass removal location; and
etching the vibrating mass to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass.
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Accused Products
Abstract
The present invention relates to a method for adjusting the resonant frequencies of a vibrating microelectromechanical (MEMS) device. In one embodiment, the present invention is a method for adjusting the resonant frequencies of a vibrating mass including the steps of patterning a surface of a device layer of the vibrating mass with a mask, etching the vibrating mass to define a structure of the vibrating mass, determining a first set of resonant frequencies of the vibrating mass, determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass, removing the mask at the mass removal location, and etching the vibrating mass to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass.
35 Citations
31 Claims
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1. A method for adjusting the resonant frequencies of a vibrating mass comprising the steps of:
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patterning a surface of a device layer of the vibrating mass with a mask; etching the vibrating mass to define a structure of the vibrating mass; determining a first set of resonant frequencies of the vibrating mass; determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass; removing the mask at the mass removal location; and etching the vibrating mass to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for adjusting the resonant frequencies of a vibrating MEMS device comprising the steps of:
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patterning a surface of the vibrating MEMS device with photoresist, the photoresist having open areas located where the MEMS device should be etched; etching the vibrating MEMS device at locations corresponding to the open areas; determining a first resonant frequency of the vibrating MEMS device along a first axis and a second resonant frequency of the vibrating MEMS device along a second axis; determining a first mass removal amount of the vibrating MEMS device and a first mass removal location of the vibrating MEMS device to alter the first resonant frequency and reduce a resonant frequency difference between the first resonant frequency and the second resonant frequency; removing the photoresist at the first mass removal location using laser ablation; and etching the vibrating MEMS device to remove the first mass removal amount of the vibrating MEMS device at the first mass removal location of the vibrating MEMS device. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method for adjusting resonant frequencies of a vibrating MEMS device comprising the steps of:
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determining a first resonant frequency of the vibrating MEMS device along the first axis and a second resonant frequency of the vibrating MEMS device along the second axis; determining a mass removal amount of the vibrating MEMS device and a mass removal location of the vibrating MEMS device to alter the first resonant frequency and reduce a resonant frequency difference between the first resonant frequency and the second resonant frequency; coating a surface of the vibrating MEMS device with a masking material; removing the masking material at the mass removal location using laser ablation; and etching the vibrating MEMS device to remove the mass removal amount of the vibrating MEMS device at the mass removal location of the vibrating MEMS device. - View Dependent Claims (27, 28, 29, 30, 31)
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Specification