SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
First Claim
1. A substrate processing apparatus to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including water, the apparatus comprising:
- a liquid-film forming device to form a liquid film of the first processing liquid maintained at a temperature higher than room temperature on at least one surface of the substrate; and
a vapor/mist supply device to supply vapor or mist of the second processing liquid to the surface of the substrate on which the liquid film of the first processing liquid is formed.
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Accused Products
Abstract
Disclosed are a substrate processing apparatus and a substrate processing method to efficiently remove a resist residue of a substrate surface by using sulfuric acid without hydrogen peroxide solution that is not stable in a high temperature, or by using sulfuric acid together with hydrogen peroxide solution that is not stable in a high temperature. The substrate processing apparatus to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including water includes a liquid-film forming device to form a liquid film of the first processing liquid maintained at a temperature higher than room temperature on at least one surface of the substrate, and a vapor/mist supply device to supply vapor or mist of the second processing liquid on the surface of the substrate on which the liquid film of the first processing liquid is formed. Further, the substrate processing apparatus to process a substrate within a processing chamber by using a first processing liquid including sulfuric acid and a second processing liquid including hydrogen peroxide solution includes a processing tank to store the first processing liquid at a temperature higher than room temperature, a substrate elevating mechanism to move the substrate up and down between the processing tank and the processing chamber, and a mist supply device to supply mist of the second processing liquid to a portion of the substrate in the vicinity of a liquid surface of the first processing liquid stored in the processing tank when the substrate is lifted from or immersed into the processing tank by the substrate elevating mechanism.
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Citations
22 Claims
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1. A substrate processing apparatus to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including water, the apparatus comprising:
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a liquid-film forming device to form a liquid film of the first processing liquid maintained at a temperature higher than room temperature on at least one surface of the substrate; and a vapor/mist supply device to supply vapor or mist of the second processing liquid to the surface of the substrate on which the liquid film of the first processing liquid is formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A substrate processing method to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including water, the method comprising:
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forming a liquid film of the first processing liquid maintained at a temperature higher than room temperature on at least one surface of the substrate; and supplying vapor or mist of the second processing liquid to the surface of the substrate on which the liquid film of the first processing liquid is formed. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A substrate processing apparatus to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including hydrogen peroxide solution, the apparatus comprising:
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a processing tank to store the first processing liquid at a temperature higher than room temperature; a processing chamber to process the substrate by using the first processing liquid and the second processing liquid, the processing chamber being disposed above the processing tank; a substrate elevating mechanism to move the substrate up and down between the processing tank and the processing chamber; and a mist supply device to supply mist of the second processing liquid to a portion of the substrate in the vicinity of the liquid surface of the first processing liquid stored in the processing tank when the substrate is lifted from or immersed into the processing tank by the substrate elevating mechanism. - View Dependent Claims (16, 17, 18, 19)
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20. A substrate processing method to process a substrate by using a first processing liquid including sulfuric acid and a second processing liquid including hydrogen peroxide solution, the method comprising:
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forming a liquid film of the first processing liquid maintained at a temperature higher than room temperature on the substrate by immersing the substrate into or lifting the substrate from the first processing liquid maintained at the temperature higher than room temperature; and supplying mist of the second processing liquid to a portion of the substrate in the vicinity of the liquid surface of the first processing liquid. - View Dependent Claims (21, 22)
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Specification