PACKAGING STRUTURE FOR HIGH POWER LIGHT EMITTING DIODE(LED) CHIP

• US 20100096642A1
• Filed: 10/20/2008
• Published: 04/22/2010
• Est. Priority Date: 10/20/2008
• Status: Abandoned Application

• Current Assignee: Brilliant Technology Company Limited (Nidec Corporation)
• Original Assignee: Brilliant Technology Company Limited (Nidec Corporation)
• Inventors: Yu, Hao-Jan, Chang, Chung-Chi
• Application Number:
  US12/254,821
• Publication Number:
  US 20100096642A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

The present invention relates to a packaging structure for high-power light emitting diode (LED) chip, comprising a metal plate, insulators and a cover plate. The metal plate comprises a containing slot and isolating slots formed on the surface by working, and the insulators can be embedded in the isolating slot. After forming a hollow slot and notches on the surface of the cover plate by working, the cover plate is combined with the metal plate and insulators and at the same time, the hollow slot and the notches are corresponding to the containing slot and the isolating slots on the metal plate to form a hollowness state, followed by application of surface treatment to form soldering portions and an anti-soldering layer at the bottom of the metal plate. Then the metal plate is cut on both sides along free ends of the insulators so as to generate electrode contacts with positive and negative electrodes, and the surface mount technology (SMT) can be adopted for assembly of the packaging structure of high-power LED chip so as to simplify manufacturing processes, facilitate mass production and achieve separation of electricity from heat, etc.

Claims

1. A packaging structure for high-power light emitting dioxide (LED) chip, comprising:

a metal plate, said metal plate having a die bonding area formed on a surface for mounting at least one chip, and two isolating slots set up in reverse directions on two external opposite sides of said die bonding area;

two insulators, said insulators made in the size that fits with said isolating slots and can be embedded into said insolating slots, and each comprising a base, and a plurality of extended portions in interval arrangements extended from one side of said base; and

a cover plate, said cover plate combined with said metal plate and said insulators, and comprising a hollow slot on its surface, and two notches formed on two side edges;

wherein, after combining, said hollow slot and said notches of said cover plate are corresponding to said containing slot and said isolating slots of said metal plate respectively to form a hollowness state, and then the metal plate is cut on both sides along free ends of said extended portions of said insulators to form electrode contacts between said adjacent insulators.

2. The packaging structure for high-power LED chips according to claim 1, wherein said metal plate further comprises at least one containing slot on the surface, and said die bonding area is in said containing slot for mounting said chip.

3. The packaging structure for high-power LED chips according to claim 2, wherein light-conducting surfaces at vertical or inclination angles are formed on inner sidewalls of said containing slot of said metal plate.

4. The packaging structure for high-power LED chips according to claim 2, wherein said containing slot formed on the surface of said metal plate is by means of working, and the working methods may include means of machining, chemical etching and punching.

5. The packaging structure for high-power LED chips according to claim 1, wherein said isolating slots formed on the surface of said metal plate is by means of working, and the working methods may include such means of machining, chemical etching and punching.

6. The packaging structure for high-power LED chips according to claim 1, wherein said isolating slots can be shaped like E, M, and U, or installed in interval arrangements or in the form of lattices.

7. The packaging structure for high-power LED chips according to claim 1, wherein said electrode contacts have both positive electrodes and negative electrodes, and wires connected to said chip can be connected electrically with said positive electrodes and said negative electrodes respectively.

8. The packaging structure for high-power LED chips according to claim 1, wherein said metal plate comprises soldering portions at the bottom between said die bonding area and said isolating slots by a surface treatment which may be electroplating or sputtering.

9. The packaging structure for high-power LED chips according to claim 8, wherein an anti-soldering layer is formed on the external edges of said soldering portions at the bottom of said metal plate by a surface treatment which may be silk screening, roller coating and spraying, etc.

10. The packaging structure for high-power LED chips according to claim 1, wherein said metal plate may be made of metal materials with electric and thermal conductivity, such as copper and aluminum.

11. The packaging structure for high-power LED chips according to claim 1, wherein said insulators may be made of ceramic, high polymer and compound materials.

12. The packaging structure for high-power LED chips according to claim 1, wherein said insulators may be made through the processing method of silk screening, roller coating and integrated injection molding, etc.

13. The packaging structure for high-power LED chips according to claim 1, wherein light-conducting surfaces at vertical or inclination angles are formed on the internal sidewalls of said hollow slots on said cover plate.

14. The packaging structure for high-power LED chips according to claim 1, wherein said hollow slot and said notches formed on the surface of said cover plate is by means of working, and the working methods may include such means of machining, chemical etching and integrated injection molding, etc.

15. The packaging structure for high-power LED chips according to claim 1, wherein said cover plate may be made of metal, ceramic, high polymer and composite materials.

16. The packaging structure for high-power LED chips according to claim 1, wherein a wire bonding area and an electric testing area are formed on said metal plate where said electrode contacts project over said hollow slots and said notches of said cover plate.

17. The packaging structure for high-power LED chips according to claim 1, wherein said metal plate and said cover plate may be of a rectangular, circular, elliptic and polygonal shape.

18. The packaging structure for high-power LED chips according to claim 1, wherein said hollow slot and said notches of said cover plate may be of a rectangular, circular, elliptic and polygonal shape.