SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND SIGNAL POST
First Claim
Patent Images
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes first and second openings;
a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and
a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;
wherein the semiconductor device is above and overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base and extends laterally from the thermal post to or beyond the terminal;
wherein the pad extends above the adhesive and the terminal extends below the adhesive; and
wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts have the same thickness and are coplanar with one another, and the base and the terminal have the same thickness and are coplanar with one another.
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Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.
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Citations
50 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post; wherein the semiconductor device is above and overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base and extends laterally from the thermal post to or beyond the terminal; wherein the pad extends above the adhesive and the terminal extends below the adhesive; and wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts have the same thickness and are coplanar with one another, and the base and the terminal have the same thickness and are coplanar with one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad, a terminal, a routing line and a signal post, wherein the routing line is adjacent to pad, the signal post is adjacent to the routing line and the terminal, extends below the pad and the routing line and extends above the terminal, and an electrically conductive path between the pad and the terminal includes the routing line and the signal post; wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, does not overlap the signal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, covers and surrounds the posts in the lateral directions and extends to peripheral edges of the assembly; wherein the pad extends above the adhesive; and wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts have the same thickness and are coplanar with one another and extend through the adhesive, the base and the terminal have the same thickness and are coplanar with one another and extend below the adhesive, and tops and bottoms of the posts are coplanar with the adhesive. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a pad and a dielectric layer, wherein first and second apertures extend through the substrate; and a conductive trace that includes the pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post; wherein the semiconductor device is above and overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a first gap in the first aperture between the thermal post and the substrate and into a second gap in the second aperture between the signal post and the substrate, extends across the dielectric layer in the gaps, extends laterally from the thermal post to or beyond the terminal and is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer and between the base and the dielectric layer; wherein the substrate is mounted on the adhesive and extends above the base; wherein the pad extends above the dielectric layer and the terminal extends below the adhesive; and wherein the thermal post extends into the first opening and the first aperture, the signal post extends into the second opening and the second aperture, the posts have the same thickness and are coplanar with one another, and the base and the terminal have the same thickness and are coplanar with one another. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post, a base and a cap, wherein the thermal post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, and the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post; a substrate that includes a pad, a routing line and a dielectric layer, wherein first and second apertures extend through the substrate; a conductive trace that includes the pad, the routing line, a terminal and a signal post, wherein the routing line is adjacent to pad, the signal post is adjacent to the routing line and the terminal, extends below the pad and the routing line and extends above the terminal, and an electrically conductive path between the pad and the terminal includes the routing line and the signal post; wherein the semiconductor device is mounted on the cap, overlaps the thermal post, does not overlap the signal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a first gap in the first aperture between the thermal post and the substrate and into a second gap in the second aperture between the signal post and the substrate, extends across the dielectric layer in the gaps, is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer and between the base and the dielectric layer, covers and surrounds the posts in the lateral directions and extends to peripheral edges of the assembly; wherein the pad extends above the dielectric layer; and wherein the thermal post extends into the first opening and the first aperture, the signal post extends into the second opening and the second aperture, the posts have the same thickness and are coplanar with one another and extend through the adhesive and the dielectric layer, the base and the terminal have the same thickness and are coplanar with one another and extend below the adhesive and the dielectric layer, and tops and bottoms of the posts are coplanar with the adhesive. - View Dependent Claims (47, 48, 49, 50)
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Specification