Semiconductor Device and Method of Manufacturing the Same
First Claim
1. A method of manufacturing a semiconductor device, comprising:
- (a) forming a buffer layer on a semiconductor substrate;
(b) patterning the buffer layer in a first direction to form buffer layer patterns having lateral surfaces and being spaced from each other at predetermined intervals;
(c) forming a semiconductor epitaxial layer on and between the buffer layer patterns;
(d) forming a first trench in the semiconductor epitaxial layer in a second direction, intersecting the first direction, to expose lateral surfaces of the buffer layer patterns;
(e) selectively removing the buffer layer patterns exposed by the first trench to form spaces;
(f) forming buried insulation films in the spaces formed by removal of the buffer layer patterns, a portion of semiconductor epitaxial layer being disposed between the buried insulation films;
(g) removing a portion of the semiconductor epitaxial layer disposed between the buried insulation films to form a second trench in the first direction; and
(h) forming device isolation films in the first and second trenches.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of manufacturing a semiconductor device and a semiconductor device manufactured by the method, the method comprising: (a) forming a buffer layer on a semiconductor substrate; (b) patterning the buffer layer in a first direction to form buffer layer patterns having lateral surfaces and being spaced from each other at predetermined intervals; (c) forming a semiconductor epitaxial layer on and between the buffer layer patterns; (d) forming a first trench in the semiconductor epitaxial layer in a second direction perpendicular to the first direction to expose lateral surfaces of the buffer layer patterns; (e) selectively removing the buffer layer patterns exposed by the first trench to form spaces; (f) forming buried insulation films in the spaces formed by removal of the buffer layer patterns, a portion of semiconductor epitaxial layer being disposed between the buried insulation films; (g) removing a portion of the semiconductor epitaxial layer disposed between the buried insulation films to form a second trench in the first direction; and (h) forming device isolation films in the first and second trenches.
39 Citations
20 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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(a) forming a buffer layer on a semiconductor substrate; (b) patterning the buffer layer in a first direction to form buffer layer patterns having lateral surfaces and being spaced from each other at predetermined intervals; (c) forming a semiconductor epitaxial layer on and between the buffer layer patterns; (d) forming a first trench in the semiconductor epitaxial layer in a second direction, intersecting the first direction, to expose lateral surfaces of the buffer layer patterns; (e) selectively removing the buffer layer patterns exposed by the first trench to form spaces; (f) forming buried insulation films in the spaces formed by removal of the buffer layer patterns, a portion of semiconductor epitaxial layer being disposed between the buried insulation films; (g) removing a portion of the semiconductor epitaxial layer disposed between the buried insulation films to form a second trench in the first direction; and (h) forming device isolation films in the first and second trenches. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device manufactured by a method comprising:
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(a) forming a buffer layer on a semiconductor substrate; (b) patterning the buffer layer in a first direction to form buffer layer patterns having lateral surfaces and being spaced from each other at predetermined intervals; (c) forming a semiconductor epitaxial layer on and between the buffer layer patterns; (d) forming a first trench in the semiconductor epitaxial layer in a second direction, intersecting the first direction, to expose lateral surfaces of the buffer layer patterns; (e) selectively removing the buffer layer patterns exposed by the first trench to form spaces; (f) forming buried insulation films in the spaces formed by removal of the buffer layer patterns, a portion of the semiconductor epitaxial layer being disposed between the buried insulation films; (g) removing a portion of the semiconductor epitaxial layer disposed between the buried insulation films to form a second trench in the first direction; and (h) forming device isolation films in the first and second trenches, wherein the semiconductor epitaxial layer formed on a semiconductor substrate is horizontally isolated by device isolation films and vertically isolated from the semiconductor substrate by a buried insulation film. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification