Semiconductor device and method of manufacturing the same
First Claim
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1. A semiconductor device, comprising:
- a substrate;
a semiconductor chip with a surface facing down mounted on the substrate;
a reinforcement material provided on the substrate in a peripheral region of a region on which the semiconductor chip is mounted; and
a heat sink coupled to the semiconductor chip via a highly thermally conductive material, the heat sink being disposed on the semiconductor chip and the reinforcement material by being coupled to the reinforcement material via an adhesive material, the heat sink being provided with an uneven area on a side coupled to the reinforcement material.
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Abstract
A semiconductor device includes: a substrate; a semiconductor chip with a surface facing down mounted on the substrate; a reinforcement material provided on the substrate in a peripheral region of a region on which the semiconductor chip is mounted; and a heat sink coupled to the semiconductor chip via a highly thermally conductive material. The heat sink is disposed on the semiconductor chip and the reinforcement material by being coupled to the reinforcement material via an adhesive material, and is provided with an uneven area on a side coupled to the reinforcement material.
53 Citations
5 Claims
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1. A semiconductor device, comprising:
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a substrate; a semiconductor chip with a surface facing down mounted on the substrate; a reinforcement material provided on the substrate in a peripheral region of a region on which the semiconductor chip is mounted; and a heat sink coupled to the semiconductor chip via a highly thermally conductive material, the heat sink being disposed on the semiconductor chip and the reinforcement material by being coupled to the reinforcement material via an adhesive material, the heat sink being provided with an uneven area on a side coupled to the reinforcement material. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a semiconductor device, comprising the steps of:
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flip-chip bonding a semiconductor chip with a surface facing down to a substrate provided with a wiring pattern; forming a reinforcement material in a peripheral region of the flip-chip bonded semiconductor chip; and coupling a heat sink, provided with an uneven area on a side coupled to the reinforcement material, to the semiconductor chip and the reinforcement material after applying a highly thermally conductive material on a back side of the semiconductor chip and applying an adhesive material on a surface of the reinforcement material.
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Specification