CONTACT SENSOR UNIT, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING A CONTACT SENSOR UNIT

• US 20100097080A1
• Filed: 06/19/2009
• Published: 04/22/2010
• Est. Priority Date: 10/22/2008
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Furukawa, Yasutoshi, Kobayashi, Hiroshi, Okada, Toru
• Granted Patent: US 8,183,873 B2
• Time in Patent Office: Days
• US Class Current: 324/692
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H03K 17/962 Capacitive touch switches

Abstract

A contact sensor unit includes: a flexible substrate having a conductive pattern; a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate; and a reinforcing member fixed on the flexible substrate and surrounding the sensor element.

Claims

1. A contact sensor unit comprising:

a flexible substrate having a conductive pattern;

a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate; and

a reinforcing member fixed on the flexible substrate and surrounding the sensor element.

2. The contact sensor unit of claim 1, further comprising an underfill material filled between the flexible substrate and the detecting surface of the sensor element.

3. The contact sensor unit of claim 1, further comprising a resin filled to cover the sensor element within the reinforcing member.

4. The contact sensor unit of claim 1, wherein the reinforcing member has a case shape.

5. The contact sensor unit of claim 1, wherein the reinforcing member has a frame shape.

6. The contact sensor unit of claim 1, wherein the reinforcing member has an inner side surface inclining toward the inside of the reinforcing member as apart from the flexible substrate.

7. The contact sensor unit of claim 1, wherein the reinforcing member has an inner side surface protruding toward the inside of the reinforcing member as apart from the flexible substrate.

8. The contact sensor unit of claim 1, further comprising:

a reinforcing plate fitted in the reinforcing member.

9. An electronic device comprising:

a contact sensor unit comprising;

a flexible substrate having a conductive pattern,

a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate, and

a reinforcing member fixed on the flexible substrate and surrounding the sensor element; and

a chassis attached with the contact sensor unit.

10. A method for producing a contact sensor unit, comprising:

mounting a sensor element on a flexible substrate;

bonding a reinforcing member on the flexible substrate to surround the sensor element while a planarization of the flexible substrate is maintained;

potting a resin within the reinforcing member to cover the sensor element; and

hardening the resin.