Machine for passively removing heat generated by an electronic circuit board
First Claim
1. A machine for passively removing heat generated by an electronic circuit board comprising:
- an electronic circuit board having a plurality of circuits and electronic components that when supplied with electrical power to function also produce heat;
high thermal conductivity moldable pads in thermal contact with and adherent to both sides of the electronic circuit board or electronic circuit board heat spreaders that form conductive pathways for the transport of heat away from electronic circuits and components;
a two piece rigid heat sink, the parts of which when coupled together form a cavity with inside surfaces that are in contact with and adherent to the top surfaces of the highly conductive moldable pads;
a two piece rigid heat sink that surrounds and encases the electronic circuit board, electronic circuit board heat spreaders and highly conductive moldable pads by means of fasteners that couple together each side of the two piece rigid heat sink to form a conductive pathway for the transport of heat away from the conductive pads; and
a plurality of thin, rigid conductive fins coupled to each top base of the two piece rigid heat sink thereby collectively forming a pathway for the transport of heat from the solid base of the two piece rigid heat sink to surrounding ambient air by means of natural or forced convection.
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Abstract
A machine for passively removing heat generated by an electronic circuit board is disclosed. In a typical embodiment an electronic circuit board of any type or size is comprised of electronic components producing heat during operation. High thermal conductivity moldable pads applied to both sides of the electronic circuit board form a conductive pathway to transport heat away from electronic circuits and components. A two piece rigid heat sink having thin rigid conductive fins on its top base is coupled together forming a cavity into which the computer board/conductive pad assembly fits, thereby forming a second conductive pathway for heat transport away from board features. The thin rigid conductive fins collectively form yet a third conductive pathway for heat transport from the solid base of the two piece rigid heat sink. Exposure of the thin rigid conductive fins to cooler surrounding air provides convective transfer of heat from the fins to ambient air.
38 Citations
14 Claims
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1. A machine for passively removing heat generated by an electronic circuit board comprising:
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an electronic circuit board having a plurality of circuits and electronic components that when supplied with electrical power to function also produce heat; high thermal conductivity moldable pads in thermal contact with and adherent to both sides of the electronic circuit board or electronic circuit board heat spreaders that form conductive pathways for the transport of heat away from electronic circuits and components; a two piece rigid heat sink, the parts of which when coupled together form a cavity with inside surfaces that are in contact with and adherent to the top surfaces of the highly conductive moldable pads; a two piece rigid heat sink that surrounds and encases the electronic circuit board, electronic circuit board heat spreaders and highly conductive moldable pads by means of fasteners that couple together each side of the two piece rigid heat sink to form a conductive pathway for the transport of heat away from the conductive pads; and a plurality of thin, rigid conductive fins coupled to each top base of the two piece rigid heat sink thereby collectively forming a pathway for the transport of heat from the solid base of the two piece rigid heat sink to surrounding ambient air by means of natural or forced convection. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification