Apparatus And Method For Reducing Crosstalk Within A Microphone

• US 20100098284A1
• Filed: 10/08/2009
• Published: 04/22/2010
• Est. Priority Date: 10/17/2008
• Status: Abandoned Application

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Conklin, Wade Forrest, Christopher, John George
• Application Number:
  US12/575,953
• Publication Number:
  US 20100098284A1
• Time in Patent Office: Days
• US Class Current: 381/369
• CPC Class Codes: H04R 19/00 Electrostatic transducers

Abstract

A microphone is provided. The microphone has a housing; a back plate positioned within the housing; a die positioned within the housing and coupled to a circuit board having conductive traces; and a conductive layer positioned between the die and the back plate, wherein the conductive layer mitigates coupling of an electrical signal between the conductive traces and the back plate.

Claims

1. A microphone comprising:

a housing;

a back plate positioned within the housing;

a die positioned within the housing and coupled to a circuit board having conductive traces; and

a conductive layer positioned between the die and the back plate, wherein the conductive layer mitigates coupling of an electrical signal between the conductive traces and the back plate.

2. The microphone of claim 1 wherein the die is a buffer circuit.

3. The microphone of claim 1 wherein the conductive layer is a printed conductive layer.

4. A microphone comprising:

a housing;

a back plate positioned within the housing;

a die positioned within the housing and coupled to a circuit board having conductive traces; and

a metal layer positioned between the die and the back plate, wherein the metal layer mitigates coupling of an electrical signal between the conductive traces and the back plate.

5. The microphone of claim 4 wherein the metal layer is conductive.

6. The microphone of claim 5 wherein the metal layer is a printed conductive layer.

7. A microphone comprising:

a housing;

a back plate positioned within the housing;

a die positioned within the housing and coupled to a circuit board wherein conductive traces are adjacent to the die; and

a metal layer positioned adjacent to the die, wherein the metal layer mitigates coupling of an electrical signal between the conductive traces and the back plate.

8. The microphone of claim 7 wherein the metal layer is conductive.

9. A microphone comprising:

a housing;

a back plate positioned within the housing;

a die positioned within the housing and coupled to a circuit board wherein conductive traces are adjacent to the die; and

a conductive layer positioned adjacent to the die, wherein the conductive layer mitigates coupling of an electrical signal between the conductive traces and the back plate.

10. The microphone of claim 9 wherein the conductive layer is a printed conductive layer.