BORON FILM INTERFACE ENGINEERING
First Claim
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1. A method of depositing a bilayer liner in a trench on a substrate in a processing chamber, the method comprising:
- forming an initiation layer having a thickness less than or about 15 Å and
comprising at least one of the group of elements consisting of nitrogen and carbon; and
forming a boron-containing layer on the initiation layer;
wherein the initiation layer reduces diffusion of boron from the boron-containing layer into the substrate.
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Abstract
Methods of depositing boron-containing liner layers on substrates involve the formation of a bilayer including an initiation layer which includes barrier material to inhibit the diffusion of boron from the bilayer into the underlying substrate.
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Citations
21 Claims
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1. A method of depositing a bilayer liner in a trench on a substrate in a processing chamber, the method comprising:
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forming an initiation layer having a thickness less than or about 15 Å and
comprising at least one of the group of elements consisting of nitrogen and carbon; andforming a boron-containing layer on the initiation layer; wherein the initiation layer reduces diffusion of boron from the boron-containing layer into the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of depositing a bilayer liner on a surface of a substrate in a processing chamber, the method comprising:
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forming a layer of barrier material on an interior surface of the processing chamber, wherein the layer of barrier material comprises at least one element from the group consisting of nitrogen and carbon; transferring the substrate into the processing chamber; forming an initiation layer on the substrate by striking a plasma in the processing chamber to redistribute a portion of the diffusion-barrier material from the interior surface of the processing chamber onto the substrate, wherein the initiation layer has a thickness less than or about 15 Å
; andforming a boron-containing layer on the initiation layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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Specification