METHOD OF COMPENSATION FOR BLEACHING OF RESIST DURING THREE-DIMENSIONAL EXPOSURE OF RESIST

• US 20100099034A1
• Filed: 10/22/2009
• Published: 04/22/2010
• Est. Priority Date: 10/22/2008
• Status: Active Grant

• Current Assignee: Micronic Laser Systems AB (Mycronic AB)
• Original Assignee: Micronic Laser Systems AB (Mycronic AB)
• Inventors: Svensson, Anders, Ekberg, Mats, Wahlsten, Mikael, Sandström, Torbjörn
• Granted Patent: US 8,057,971 B2
• Time in Patent Office: Days
• US Class Current: 430/30
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G03F 7/70383 Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams maskless lithography using a programmable mask G03F7/70291
• CPC Class Codes: G03F 7/70416 2.5D lithography
• CPC Class Codes: Y10S 430/146 Laser beam

Abstract

The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.

Claims

1. A method of forming a three-dimensional latent image with good depth and shape control in a resist layer applied over a workpiece surface, the method including:

using in the resist layer a positive resist with an effective absorption characteristic that produces a log-linear relationship between exposure energy (E) and the depth of exposure (D), approximated to a first order by D=c₁ ln(E)+c₂, rather than a linear relationship;

converting a relief map that represents a three-dimensional surface into point-by-point exposure doses calculated to reach an exposure threshold of the positive resist at a plurality of controlled depths within the resist layer, taking into account the log-linear relationship, producing an exposure map; and

patterning the resist layer to form a three-dimensional latent image using a pattern generator that varies effective exposure doses on a point-by-point basis using the exposure map.

2. The method of claim 1, wherein the resist layer is a thin layer that has a vertical thickness less than or equal to a depth of focus of the pattern generator during the patterning, wherein the depth of focus is twice a Rayleigh range.

3. The method of claim 2, wherein the pattern generator is a high dynamic range pattern generator that is calibrated to produce at least 1000 dose steps between minimum and maximum exposure doses.

4. The method of claim 1, wherein the pattern generator is a high dynamic range pattern generator that is configured to write at least 4000 dose steps between minimum and maximum exposure doses.

5. The method of claim 1, wherein the pattern generator is a high dynamic range pattern generator that represents the relief map to a precision of at least 11 binary bits and uses the 11-bit precision to produce exposure doses.

6. The method of claim 1, wherein the positive resist further includes a bleachable absorption component that is converted by the exposing radiation and substantially loses its absorptiveness during the patterning.

7. The method of claim 2, wherein the positive resist includes an effective quantity of passive absorbing components that absorb photons without chemically exposing the positive resist, whereby the passive absorbing components at least contribute to cause the log-linear relationship.

8. The method of claim 7, wherein the passive absorbing components are dye and/or nano particles.

9. The method of claim 2, wherein the log-linear relationship requires at least twice as much marginal exposure energy, in addition to the c₂ starting exposure energy, to expose a lower half of the resist as the marginal exposure energy to expose an upper half of the resist.

10. The method of claim 1, wherein the log-linear relationship requires at least 100 times as much marginal exposure energy, in addition to the c₂ starting exposure energy, to expose a lower quarter of the resist as the marginal exposure energy to expose an upper quarter of the resist.

11. The method of claim 1, wherein the positive resist has a gamma of 5 or greater, wherein the gamma corresponds to steepness of an exposure-to-remaining thickness curve.

12. The method of claim 2, wherein the positive resist has a gamma of 8 or greater, wherein the gamma corresponds to steepness of an exposure-to-remaining thickness curve.

13. The method of claim 2, wherein the pattern generator is a laser pattern generator.

14. The method of claim 1, wherein the resist layer is a thick resist layer applied over a workpiece surface, the method including:

using in the thick resist layer a positive resist with gamma of 5 or greater, wherein the gamma corresponds to steepness of an exposure-to-remaining thickness curve; and

patterning the resist layer in multiple writing passes to form a three-dimensional latent image using a high dynamic range pattern generator that varies effective exposure doses on a point-by-point basis using the exposure map, wherein the high dynamic range pattern generator is calibrated to produce at least 1000 dose steps between minimum and maximum exposure doses.

15. The method of claim 14, wherein the resist layer is a thick resist layer with a vertical thickness that is greater than or equal to 1.5 times a depth of focus of the pattern generator during the patterning, wherein the depth of focus is twice a Rayleigh range.

16. The method of claim 14, wherein the resist layer is a thick resist layer with a vertical thickness that is greater than or equal to two times a depth of focus of the pattern generator during the patterning, wherein the depth of focus is twice a Rayleigh range.

17. The method of claim 14, wherein the positive resist has a gamma of 8 or greater.

18. The method of claim 14, wherein the positive resist includes a bleachable absorption component that is converted by the exposing radiation and substantially loses it absorptiveness during the patterning, whereby the bleachable components cause a linear relationship between exposure energy (E) and the depth of exposure (D).

19. The method of claim 14, wherein the positive resist includes an effective quantity of passive absorption component that absorbs photons without chemically exposing the positive resist, whereby the passive absorption component causes a log-linear relationship between exposure energy (E) and the depth of exposure (D).

20. The method of claim 14, wherein the pattern generator is a laser pattern generator.