LASER MACHINING

• US 20100099239A1
• Filed: 11/27/2007
• Published: 04/22/2010
• Est. Priority Date: 11/27/2006
• Status: Active Grant

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Dunne, Kali, O'Briain Fallon, Cillian
• Granted Patent: US 7,947,575 B2
• Time in Patent Office: Days
• US Class Current: 438/463
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/3576 Diminishing rugosity, e.g. grinding; Polishing; Smoothing

Abstract

A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulses 81 at the substrate do not overlap but are either contiguous or spaced apart. Pulses 82, 83, 84 in respective succeeding scans of the laser along the scan line, are offset with respect to the starting point of pulses 81, 82, 83 in a previous scan so that multiple successive laser scans provide machining to a required depth while successively smoothing edges, 91, 92, 93, 94 of the feature with each pass.

Claims

1. A method of laser machining a feature in a substrate comprising:

a. machining the substrate with a pulsed laser along a linear scan line with a first scan such that a centre to centre spatial distance at the substrate between successive pulses in the laser pulse train is equal to at least a sum of radii of the successive pulses and the successive pulses at the substrate do not overlap but are either contiguous or spaced apart; and

b. machining with succeeding scans of the laser along the same scan line which are offset along the scan line by less than a diameter of the pulses with respect to the starting point of a previous scan so that pulses of multiple successive laser scans overlap pulses of preceding scans to provide machining to a required depth while smoothing edges of the feature.

2. A method as claimed in claim 1, wherein successive pulses are sufficiently separated on the substrate that a plume produced by a laser pulse does not substantially absorb energy from a succeeding pulse.

3. A method as claimed in claim 1, comprising machining with a pulse repetition rate of 200 kHz to 300 kHz.

4. A method as claimed in claim 1, comprising complete dicing or slot cutting through the substrate.

5. A method as claimed in claim 1, wherein the machining comprises a laser dicing process for semiconductor dicing.

6. A method as claimed in claim 1, wherein the machining comprises slot drilling.