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SEMICONDUCTOR MANUFACTURING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, STORAGE MEDIUM AND COMPUTER PROGRAM

  • US 20100099254A1
  • Filed: 10/01/2007
  • Published: 04/22/2010
  • Est. Priority Date: 10/02/2006
  • Status: Abandoned Application
First Claim
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1. A semiconductor manufacturing apparatus for performing processing on a substrate which has been subjected to an alloy layer forming process of forming an alloy layer of copper and an additive metal along a wall surface of a recess in an interlayer dielectric film and to an annealing process forming a barrier layer formed of a compound of the additive metal and a constituent element of the interlayer dielectric film, the apparatus comprising:

  • a loader module at which a carrier for accommodating therein the substrate is mounted and which performs loading and unloading of the substrate into and from the carrier;

    a vacuum transfer chamber module having a vacuum atmosphere transfer chamber, into which the substrate is transferred from the loader module, and a substrate transfer unit provided in the transfer chamber;

    a surface treatment module having a processing vessel, which is airtightly connected with the transfer chamber and includes a mounting unit for mounting the substrate thereon, and a unit for supplying a vapor of a organic acid or a ketone into the processing vessel to remove the additive metal or an oxide of the additive metal on the substrate subjected to the annealing process; and

    a film forming module having a processing chamber, which is airtightly connected with the transfer chamber and includes therein a mounting unit for mounting the substrate thereon, and a unit for filling copper in a recess on the substrate processed in the surface treatment module.

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