Biochip Package Structure

• US 20100099582A1
• Filed: 12/17/2008
• Published: 04/22/2010
• Est. Priority Date: 10/20/2008
• Status: Abandoned Application

• Current Assignee: National Chip Implementation Center National Applied Research Laboratories
• Original Assignee: National Chip Implementation Center National Applied Research Laboratories
• Inventors: Tsai, Hann-huei, Lin, Chen-Fu, Chiu, Chin-Fong, Juang, Ying-Zong
• Application Number:
  US12/336,855
• Publication Number:
  US 20100099582A1
• Time in Patent Office: Days
• US Class Current: 506/39
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2400/0439 ultrasonic vibrations, vibrating piezo elements
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: C40B 60/12 for screening libraries
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

A biochip package structure is provided. The biochip package structure includes a substrate, a biochip, at least one wire, and a molding compound. The substrate has a circuit unit electrically connected, by wiring, to the biochip defined with a sensing region. The molding compound covers the wire but leaves the sensing region of the biochip exposed, allowing a cavity to be formed in the sensing region. The cavity delivers a biomedical sample. The biomedical sample reacts in the sensing region. Thus, the biochip package structure is applicable to various medical and biochemical assays.

Claims

1. A biochip package structure, comprising:

a substrate with a circuit unit;

a biochip coupled to the substrate and defined with at lease one sensing region;

at least one wire electrically connecting the circuit unit and the biochip; and

a molding compound for covering the wire but leaving the sensing region expose so as to form a cavity in the sensing region.

2. The biochip package structure of claim 1, further comprising a cover facing the biochip and fixed in position to the molding compound to fully cover the cavity and form a micro-fluidic channel.

3. The biochip package structure of claim 2, wherein the cover is made of a biocompatible material.

4. The biochip package structure of claim 2, wherein the cover is made of a material penetrable to light.

5. The biochip package structure of claim 2, wherein the cover is made of a material impenetrable to light.

6. The biochip package structure of claim 2, wherein the cover is flexible.

7. The biochip package structure of claim 6, further comprising a micro-fluidics driving unit attached to the cover.

8. The biochip package structure of claim 7, wherein the micro-fluidics driving unit is a pneumatic micro-pump.

9. The biochip package structure of claim 7, wherein the micro-fluidics driving unit is a piezoelectric micro-pump.