Acceleration sensor
2 Assignments
0 Petitions
Accused Products
Abstract
An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.
9 Citations
33 Claims
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1-29. -29. (canceled)
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30. An acceleration sensor comprising:
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a case that includes; a bottom wall having a top side and a bottom side, the top side of the bottom wall having a central region and a peripheral region that surrounds the central region; and a side wall attached to the bottom wall and extending upward from the bottom wall in a height direction; an integrated circuit attached to the central region of the top side of the bottom wall, the integrated circuit having a top side; a semiconductor acceleration sensor chip supported on the integrated circuit, the sensor chip including; a fixed portion mounted on the top side of the integrated circuit; a plummet portion surrounding the integrated circuit without contacting the integrated circuit, the plummet portion being disposed outward of the integrated circuit, above the peripheral region of the top side of the bottom wall; and a beam portion connecting the fixed portion and the plummet portion, the beam portion having a thickness that is thinner than the thickness of the fixed portion; a terminal outside the case; first wiring that electrically connects the terminal to the sensor chip; and second wiring that electrically connects the integrated circuit to the sensor chip.
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31. The acceleration sensor according to claim 35, further comprising:
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a plurality of first electrodes formed on a surface of the fixed portion; and a plurality of second electrodes formed on a surface of the integrated circuit, wherein the second wiring includes a bonding wire that electrically connects one of the first electrodes and one of the second electrodes.
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32. The acceleration sensor according to claim 35, wherein the wiring has a portion that is embedded in the side wall and extends in the height direction of the side wall.
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33. The acceleration sensor according to claim 37, wherein the terminal is disposed on the bottom side of the bottom wall at a position aligned with the portion of the wiring that is embedded in the side wall and that extends in the height direction of the side wall.
Specification