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Semiconductor device and passive component integration in a semiconductor package

  • US 20100102327A1
  • Filed: 06/05/2009
  • Published: 04/29/2010
  • Est. Priority Date: 02/26/2008
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a substrate having lower and upper surfaces;

    at least one passive component coupled to first and second conductive pads on said upper surface of said substrate;

    at least one semiconductor device coupled to a first conductive pad on said lower surface of said substrate;

    said at least one semiconductor device having a first electrode for electrical and mechanical connection to a conductive pad external to said semiconductor package.

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