Bendable electronic device status information system and method

• US 20100103123A1
• Filed: 07/31/2009
• Published: 04/29/2010
• Est. Priority Date: 08/29/2008
• Status: Active Grant

• Current Assignee: The Invention Science Fund I, L.L.C. (Intellectual Ventures LLC)
• Original Assignee: Searete LLC (Intellectual Ventures LLC)
• Inventors: Cohen, Alexander J., Rinaldo, John D. JR., Lord, Richard T., Lord, Robert W., Jung, Edward K.Y., Levien, Royce A., Malamud, Mark A.
• Granted Patent: US 8,777,099 B2
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 1/1601 Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays constructional details related to flat displays integrated in a portable computer, e.g. laptop, handheld computer G06F1/1637; constructional details related to television receivers H04N5/64
• CPC Class Codes: G06F 1/1615 with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function constructional details of portable telephones comprising a plurality of mechanically joined movable body parts H04M1/0206
• CPC Class Codes: G06F 1/1652 the display being flexible, e.g. mimicking a sheet of paper, or rollable
• CPC Class Codes: G06F 1/1677 for detecting open or closed state or particular intermediate positions assumed by movable parts of the enclosure, e.g. detection of display lid position with respect to main body in a laptop, detection of opening of the cover of battery compartment
• CPC Class Codes: G06F 3/0481 based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
• CPC Class Codes: G09G 2380/14 Electronic books and readers
• CPC Class Codes: G09G 3/03 specially adapted for displays having non-planar surfaces, e.g. curved displays
• CPC Class Codes: G09G 3/3433 using light modulating elements actuated by an electric field and being other than liquid crystal devices and electrochromic devices using liquid crystal devices G09G3/36; using electrochromic devices G09G3/38

Abstract

A system includes, but is not limited to: obtaining and one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information. In addition to the foregoing, other related system/system aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Claims

1. A system comprising:

one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device; and

one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information.

2. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation detection modules configured to direct obtaining detection information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

4. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation stress modules configured to direct obtaining stress information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

7. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more surface contact modules configured to direct obtaining surface contact information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

9. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation geometry modules configured to direct obtaining geometrical information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

11. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more optical fiber modules configured to direct obtaining optical fiber derived information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

12. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation association modules configured to direct obtaining information based on one or more associations between two or more of the positions of one or more portions of one or more regions of the bendable electronic device.

14. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation selection modules configured to direct obtaining selection information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

15. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more origami-like folding modules configured to direct obtaining origami-like folding information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

16. The system of claim 15, wherein one or more origami-like folding modules configured to direct obtaining origami-like folding information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device comprises:

one or more folding sequence modules configured to direct obtaining information regarding one or more orders of folding sequences of one or more portions of one or more regions of the bendable electronic device associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

19. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more bend number modules configured to direct obtaining bend number information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

21. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation transient modules configured to direct obtaining substantially transient information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

24. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation connection modules configured to direct obtaining connection sequence information of two or more connections between two or more of the portions of the one or more regions of the bendable electronic device associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

25. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation draping modules configured to direct obtaining draping information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

27. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more conformation curvilinear modules configured to direct obtaining information derived through sensing one or more curvilinear patterns of force imparted upon one or more portions of one or more regions of the bendable electronic device associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

30. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more bend radius modules configured to direct filtering information based upon radius of bend associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

32. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more bend location modules configured to direct obtaining bend location information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

33. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more position detection modules configured to direct detecting information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

36. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more edge obtaining modules configured to direct obtaining information from one or more boundary transducers located approximate an edge of the bendable electronic device associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

38. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more accelerometer obtaining modules configured to direct obtaining accelerometer information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

40. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more inertial obtaining modules configured to direct obtaining inertial information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

41. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more geographical obtaining modules configured to direct obtaining geographical position information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

42. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more reference obtaining modules configured to direct obtaining position information relative to a reference associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

43. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more GPS obtaining modules configured to direct obtaining position information relative to a global positioning satellite reference associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

44. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more table obtaining modules configured to direct obtaining position information relative to a table top reference grid associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

45. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more position obtaining modules configured to direct obtaining position information relative to other portions of the bendable electronic device associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

46. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more edge detection modules configured to direct obtaining edge detection information relative to one or more edges of the bendable electronic device associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

47. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more beacon obtaining modules configured to direct obtaining position information relative to a reference beacon associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

48. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more light obtaining modules configured to direct obtaining position information relative to a light source associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

49. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more triangulation obtaining modules configured to direct obtaining position information relative to radio frequency triangulation associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

50. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more audio obtaining modules configured to direct obtaining position information relative to an audio source associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

51. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more map location obtaining modules configured to direct obtaining map location information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

52. The system of claim 1, wherein the one or more position obtaining modules configured to direct obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

one or more location obtaining modules configured to direct obtaining location information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

53. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more first information sending modules configured to direct sending the first information regarding one or more positions of one or more portions of one or more regions of the bendable electronic device.

54. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more conformation sending modules configured to direct sending information associated with one or more conformations of one or more portions of one or more regions of the bendable electronic device.

55. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more conformation change modules configured to direct sending information associated with one or more changes in one or more conformations of one or more portions of one or more regions of the bendable electronic device.

56. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence sending modules configured to direct sending information associated with one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable electronic device.

57. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence change modules configured to direct sending information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable electronic device.

58. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more orientation sending modules configured to direct sending information associated with one or more orientations of one or more portions of one or more regions of the bendable electronic device.

59. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more orientatin change modules configured to direct sending information associated with one or more changes in one or more orientations of one or more portions of one or more regions of the bendable electronic device.

60. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence sending modules configured to direct sending information associated with one or more sequences of two or more orientations of one or more portions of one or more regions of the bendable electronic device.

61. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence change modules configured to direct sending information associated with one or more changes in one or more sequences of two or more orientations of one or more portions of one or more regions of the bendable electronic device.

62. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more orientation sending modules configured to direct sending information associated with one or more orientations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

63. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more orientation change modules configured to direct sending information associated with one or more changes in one or more orientations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

64. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence sending modules configured to direct sending information associated with one or more sequences of two or more orientations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

65. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence change modules configured to direct sending information associated with one or more changes in one or more sequences of two or more orientations with respect to another object of one or more portions of one or more regions of the bendable electronic device with respect to another object.

66. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more location sending modules configured to direct sending information associated with one or more locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

67. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more location change modules configured to direct sending information associated with one or more changes in one or more locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

68. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence sending modules configured to direct sending information associated with one or more sequences of two or more locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

69. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more sequence change modules configured to direct sending information associated with one or more changes in one or more sequences of two or more locations with respect to another object of one or more portions of one or more regions of the bendable electronic device with respect to another object.

70. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more GPS sending modules configured to direct sending information associated with one or more GPS locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

71. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more GPS change modules configured to direct sending information associated with one or more changes in one or more GPS locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

72. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more GPS sequence modules configured to direct sending information associated with one or more sequences of two or more GPS locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

73. The system of claim 1, wherein the one or more physical status sending modules configured to direct sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

one or more GPS sequence change modules configured to direct sending information associated with one or more changes in one or more sequences of two or more GPS locations with respect to another object of one or more portions of one or more regions of the bendable electronic device with respect to another object.

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