Array layout for color mixing

• US 20100103660A1
• Filed: 10/24/2008
• Published: 04/29/2010
• Est. Priority Date: 10/24/2008
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: Cree Lighting Company (Ideal Industries Incorporated)
• Inventors: van de Ven, Antony P., Negley, Gerald
• Granted Patent: US 9,425,172 B2
• Time in Patent Office: Days
• US Class Current: 362/231
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Lamps, luminaries or solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. The discrete light sources are arranged in an array pursuant to certain guidelines to promote mixing of light from light sources emitting different colors of light. One embodiment solid state lighting component comprises a light emitting diode (LED) component having an array of LED chips having a first group of LED chips and one or more additional groups of LED chips. The array is arranged so that no two LED chips from said first group are directly next to one another in the array, that less than fifty percent (50%) of the LED chips in the first group of LEDs is on the perimeter of the array, and at least three LED chips from the one or more additional groups is adjacent each of the LED chips in the first group.

Claims

1. A light emitting diode (LED) component, comprising;

an array of LED chips comprising groups of first and second LED chips, said first group of LED chips arranged so that no two of the first group LED chips are directly next to one another in said array; and

a lens over at least a portion of said array.

2. The LED component of claim 1, wherein said first group of LEDs chips comprise red emitting LED chips.

3. The LED component of claim 1, wherein said second group of LED chips comprises blue shifted yellow (BSY) chips.

4. The LED component of claim 1, wherein said LED chips are mounted on a submount.

5. The LED component of claim 4, further comprising die attach pads, conductive traces and contact pads on the top surface of said submount.

6. The LED component of claim 5, wherein said conductive traces connect said first and second groups of LED chips in respective serial strings.

7. The LED component of claim 5, wherein said contact pads are at the edge of said submount and along one side of said submount.

8. The LED component of claim 1, first comprising two ESD protection devices, each of which is mounted to a respective one of said strings to protect said LED chips on said strings from ESD damage.

9. The LED component of claim 1, wherein said LED chips further comprise a third group of LED chips.

10. The LED component of claim 9, wherein said second and third group of LED chips comprise BSY LEDs of different BSY hues.

11. The LED component of claim 9, where said first group of LED chips comprises at least one LED chip emitting light having a wavelength in the range of 600 nm to 640 nm.

12. The LED component of claim 9, wherein said second group of LED chips comprises at least one LED chip emitting light having x, y color coordinates which define a point which is within an area on a 1931 CIE Chromaticity Diagram enclosed by first, second, third, fourth and fifth line segments, the first line segment connecting a first point to a second point, the second line segment connecting the second point to a third point, the third line segment connecting the third point to a fourth point, the fourth line segment connecting the fourth point to a fifth point, and the fifth line segment connecting the fifth point to the first point, the first point having x, y coordinates of 0.32, 0.40, the second point having x, y coordinates of 0.36, 0.48, the third point having x, y coordinates of 0.43, 0.45, the fourth point having x, y coordinates of 0.42, 0.42, and the fifth point having x, y coordinates of 0.36, 0.38.

13. The LED component of claim 9, wherein third group of LED chips comprises at least one LED chip emitting light having x, y color coordinates which define a point which is within an area on a 1931 CIE Chromaticity Diagram enclosed by first, second, third, fourth and fifth line segments, the first line segment connecting a first point to a second point, the second line segment connecting the second point to a third point, the third line segment connecting the third point to a fourth point, the fourth line segment connecting the fourth point to a fifth point, and the fifth line segment connecting the fifth point to the first point, the first point having x, y coordinates of 0.32, 0.40, the second point having x, y coordinates of 0.36, 0.48, the third point having x, y coordinates of 0.43, 0.45, the fourth point having x, y coordinates of 0.42, 0.42, and the fifth point having x, y coordinates of 0.36, 0.38.

14. A light emitting diode (LED) component, comprising;

an array of LED chips comprising a first group of LED chips and one or more additional groups of LED chips, said first group of LEDs arranged so that at least three LED chips from said one or more additional groups is adjacent to each of said LED chips in said first group; and

a lens over at least a portion of the array.

15. The LED component of claim 14, wherein said first group of LEDs chips comprise red emitting LED chips.

16. The LED component of claim 14, wherein said one or more additional groups of LED chips comprises first and second groups of blue shifted yellow (BSY) LED chips.

17. The LED component of claim 14, wherein said LEDs chips are mounted on a submount.

18. The LED component of claim 14, wherein each of said first and said one or more additional groups of LEDs is connected in a respective series string.

19. The LED component of claim 18, arranged so that different electrical signals can be applied to each of said series strings.

20. The LED component of claim 14, a plurality of ESD protection devices, each of which is mounted to a respective one of said strings to protect said LED chips on said strings from ESD damage.

21. A light emitting diode (LED) component, comprising;

an array of LED chips mounted on a submount, said array of LED chips comprising a first group of LED chips and one or more additional groups of LED chips, said array arranged so that less than fifty percent (50%) of the LED chips in said first group of LED chips is on the perimeter of said array.

22. The LED component of claim 21, further comprising a submount and a lens, wherein said LED chips are mounted to said submount and said lens is over at least a portion of the said LED chips.

23. The LED component of claim 21, wherein said first group of LED chips comprise red emitting LED chips.

24. The LED component of claim 21, wherein said one or more additional groups of LED chips comprises first and second groups of blue shifted yellow (BSY) LED chips.

25. The LED component of claim 21, wherein each of said first and said one or more additional groups of LEDs is connected in a respective series string.

26. A light emitting diode (LED) component, comprising;

an array of LED chips comprising a first group of LED chips and one or more additional groups of LED chips, said first group of LED chips arranged so that no two LED chips from said first group are directly next to one another in said array, and so that at least three LED chips from said one or more additional groups is adjacent to each of said LED chips in said first group.

27. The LED component of claim 26, wherein said LED chips are mounted to a submount with a lens over at least a portion of the said array.

28. A light emitting diode (LED) component, comprising;

an array of LED chips comprising a first group of LED chips and one or more additional groups of LED chips arranged so that;

no two LED chips from said first group are directly next to one another in said array;

less than fifty percent (50%) of the LED chips in said first group of LEDs is on the perimeter of said array; and

at least three LED chips from said one or more additional groups is adjacent each of said LED chips in said first group.

29. The LED component of claim 28 wherein said LED chips are mounted to a submount with a lens over said array.