APPARATUS FOR TRANSFERRING A WAFER
First Claim
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1. An apparatus for transferring a wafer comprising:
- a ceramic blade supporting the wafer;
an electrode disposed inside the blade, wherein electric power is applied to the electrode to generate an electrostatic force for holding the wafer;
a plurality of pads disposed on the blade, wherein the pads provide frictional forces between the wafer and the pads to prevent the wafer from moving on the blade; and
a robot arm connected with the blade to move the blade.
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Abstract
An apparatus for transferring a wafer includes a ceramic blade, an electrode, a plurality of pads, a coating layer and a robot arm. The blade supports the wafer, and the electrode is disposed inside the blade. Electric power is applied to the electrode to generate an electrostatic force for holding the wafer. The pads are disposed on an upper surface of the blade, and thus frictional forces may be provided between the wafer and the pads. The coating layer is disposed on the blade. The robot arm is connected with the blade to move the blade.
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Citations
9 Claims
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1. An apparatus for transferring a wafer comprising:
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a ceramic blade supporting the wafer; an electrode disposed inside the blade, wherein electric power is applied to the electrode to generate an electrostatic force for holding the wafer; a plurality of pads disposed on the blade, wherein the pads provide frictional forces between the wafer and the pads to prevent the wafer from moving on the blade; and a robot arm connected with the blade to move the blade. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An apparatus for transferring a wafer comprising:
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a ceramic blade supporting the wafer; an electrode disposed inside the blade, wherein electric power is applied to the electrode to generate an electrostatic force for holding the wafer; a coating layer disposed on the blade, wherein the coating layer is denser than the blade; and a robot arm connected to the blade to move the blade.
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Specification