DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME

• US 20100104786A1
• Filed: 09/30/2009
• Published: 04/29/2010
• Est. Priority Date: 10/27/2008
• Status: Abandoned Application

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.)
• Inventors: CHIANG, CHWAN-HWA, CHEN, JENG-SHIUNG
• Application Number:
  US12/570,098
• Publication Number:
  US 20100104786A1
• Time in Patent Office: Days
• US Class Current: 428/35.700
• CPC Class Codes: B05D 1/02 performed by spraying
• CPC Class Codes: B05D 2201/00 Polymeric substrate or laminate
• CPC Class Codes: B05D 2202/00 Metallic substrate
• CPC Class Codes: B05D 3/067 Curing or cross-linking the coating
• CPC Class Codes: B05D 5/068 achieved by multilayers B05D5/066 takes precedence
• CPC Class Codes: B05D 7/57 the last layer being a clear coat
• CPC Class Codes: H05K 5/0243 for decorative purposes
• CPC Class Codes: Y10T 428/13 Hollow or container type article [e.g., tube, vase, etc.]
• CPC Class Codes: Y10T 428/1352 Polymer or resin containing [i.e., natural or synthetic]

Abstract

A device housing and a method of fabricating the device housing are provided. The device housing includes a base housing, a bottom coating, a pattern layer, a middle coating and a top coating. The bottom coating is directly formed on the base housing. The pattern layer is a vacuum evaporation coating and directly formed on the bottom coating. The middle coating is of a degree of transparency and directly formed on the pattern layer. The transparent top coating is directly formed on the middle coating.

Claims

1. A device housing, comprising:

a base housing;

a bottom coating directly formed on the base housing;

a pattern layer being a vacuum evaporation coating and directly formed on the bottom coating;

a middle coating having a degree of transparency directly formed on the pattern layer; and

a transparent top coating directly formed on the middle coating.

2. The device housing as claimed in claim 1, wherein the pattern layer is made of a metallic material selected from a group consisting of indium (In), tin (Sn), aluminum (Al), stainless steel, chromium (Cr), silicon (Si), and silicon dioxide (SiO₂).

3. The device housing as claimed in claim 1, wherein the pattern layer has a thickness of about 30-100 nm.

4. The device housing as claimed in claim 1, wherein the middle coating is located between the top coating and the pattern layer.

5. The device housing as claimed in claim 4, wherein the middle coating is made of a UV paint, a polyurethane paint or an unsaturated polyester paint.

6. The device housing as claimed in claim 4, wherein the top coating is made of a UV paint, a polyurethane paint or an unsaturated polyester paint.

7. The device housing as claimed in claim 1, wherein the bottom coating contains a UV paint.

8. The device housing as claimed in claim 1, wherein the base housing is molded from one or more plastics selected from a group consisting of made of a plastic material selected from a group consisting of Polyethylene (PE), polyamide (PA), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET)

9. The device housing as claimed in claim 1, wherein the base housing is a metal housing .

10. A manufacturing method for device housing, comprising:

providing a base housing ;

forming a bottom coating on the surface of the base housing;

vacuum evaporating a pattern layer on the surface of the bottom coating;

forming a middle coating, having a degree of transparency, on the surface of the pattern layer; and

forming a transparent top coating on the surface of the middle coating.

11. The device housing as claimed in claim 10, wherein the bottom coating is sprayed UV paint.

12. The manufacturing method for device housing as claimed in claim 10, wherein a target for the vacuum evaporation of the pattern layer is a metallic material selected from a group consisting of indium (In), tin (Sn), aluminum (Al), stainless steel, chromium (Cr), silicon (Si), and silicon dioxide (SiO₂).

13. The manufacturing method for device housing as claimed in claim 10, wherein the vacuum evaporated pattern layer has a thickness of about 30-100 nm.

14. The manufacturing method for device housing as claimed in claim 10, wherein the middle coating is located between the top coating and the pattern layer.

15. The manufacturing method for device housing as claimed in claim 14, wherein the middle coating is sprayed UV paint, a polyurethane paint or an unsaturated polyester paint.

16. The manufacturing method for device housing as claimed in claim 10, wherein the top coating is spayed UV paint, a polyurethane paint or an unsaturated polyester paint.