MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYSTEMS (MEMS)

• US 20100105167A1
• Filed: 10/28/2008
• Published: 04/29/2010
• Est. Priority Date: 10/28/2008
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Magendanz, Galen, Eskridge, Mark
• Granted Patent: US 7,833,829 B2
• Time in Patent Office: Days
• US Class Current: 438/107
• CPC Class Codes: B81C 2203/051 Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
• CPC Class Codes: B81C 3/004 Active alignment, i.e. moving the elements in response to the detected position of the elements using internal or external actuators
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: Y10S 438/975 Substrate or mask aligning feature

Abstract

A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

Claims

1. A Micro ElectroMechanical Systems wafer comprising:

a glass layer having a first surface and a second surface, the glass layer having at least one reference feature;

a metallic layer having a first surface and a second surface, the first surface coupled to the first surface of the glass layer, the metallic layer having at least two windows extending through the metallic layer and operable to transmit light therethrough, the at least two windows arranged to permit optical detection of the at least one reference feature of the glass layer;

a plurality of MEMS components coupled to the second surface of the glass layer, and

a bump pattern arranged on the second surface of the metallic layer, the bump pattern optically aligned with the plurality of MEMS components using the at least two windows located in the metallic layer to optically locate the at least one reference feature of the glass layer.

2. The MEMS wafer of claim 1, wherein the glass layer is a silicon layer.

3. The MEMS wafer of claim 1, wherein the metallic layer is a gold metallic layer.

4. The MEMS wafer of claim 1, wherein the at least one reference feature includes a metallic trace element applied to the glass layer.

5. The MEMS wafer of claim 1, wherein the at least one reference feature includes alignment marks carried on the second surface of the glass layer.

6. A MEMS device comprising:

a substrate having a perimeter; and

a diced portion of a MEMS wafer registered with respect to at least one feature applied to the MEMS wafer, the diced portion of the MEMS wafer including a glass layer, a metallic layer, a MEMS component, and a bump pattern, wherein

the glass layer includes a first surface, a second surface and at least one reference feature,

the MEMS component coupled to the second surface of the glass layer,

the metallic layer having a first surface and a second surface, the first surface coupled to the first surface of the glass layer, and

the bump pattern arranged on the second surface of the metallic layer, the bump pattern optically aligned with the MEMS component and with the at least one reference feature of the glass layer.

7. The MEMS device of claim 6, wherein the metallic layer includes a window extending through the metallic layer and operable to transmit light there through, the window positioned to permit optical detection of the at least one reference feature of the glass layer.

8. The MEMS device of claim 6, wherein the glass layer is a silicon layer.

9. The MEMS device of claim 6, wherein the metallic layer is a gold metallic layer.

10. The MEMS device of claim 6, wherein the at least one reference feature includes a metallic trace element applied to the glass layer.

11. The MEMS device of claim 6, wherein the at least one reference feature includes alignment marks carried on the second surface of the glass layer.

12. A method for assembling a MEMS device, the method comprising:

forming a glass layer having at least one reference feature;

forming a metallic layer having at least two light transparent windows extending through the metallic layer;

attaching the metallic layer to the glass layer;

attaching a plurality of MEMS components on an opposite side of the glass layer from the metallic layer;

attaching a bump pattern on an opposite side of the metallic layer from the glass layer, the bump pattern having a plurality of bumps optically aligned with respect to the MEMS components through the at least two windows; and

forming individual MEMS dies; and

aligning and mounting the MEMS dies onto a substrate.

13. The method of claim 12, wherein forming the metallic layer includes patterning the metallic layer using a masking technique.

14. The method of claim 12, further comprising:

filling at least two windows with a light transparent material.

15. The method of claim 12, wherein attaching the bump pattern includes adhering the bump pattern.

16. The method of claim 12, wherein forming individual MEMS dies includes dicing a MEMS wafer.