Micro-SD To Secure Digital Adaptor Card And Manufacturing Method
First Claim
1. An adaptor card for adapting a micro-Secure Digital (microSD) card to communicate with a standard Secure Digital (SD) socket disposed on a host system, the adapter card comprising:
- a substrate forming a lower wall of the adaptor card, the substrate including a planar outside surface and an opposing inside surface, a front edge and an opposing rear edge;
a lead frame structure fixedly connected to the inside surface of the substrate, the lead frame structure including;
nine SD contact pads disposed on the substrate and located adjacent to the front edge of the substrate, the nine SD contact pads having respective contact surfaces facing away from the substrate and arranged in a standard SD pattern,eight microSD contact pins supported over the inside surface of the substrate and extending toward the rear edge of the substrate; and
a plurality of connector wires respectively electrically connecting each of the eight microSD contact pins and an associated one of the nine SD contact pads;
a protective cap mounted on the inside surface of the substrate, the protective cap including opposing side walls extending from the inside surface, and an upper wall supported by the side walls and disposed parallel to and spaced from a portion of the inside surface such that the opposing side walls, the upper wall and the inside surface portion define a chamber; and
an integral molded plastic casing consisting essentially of a thermoset plastic and including an upper wall formed on the inside surface of the substrate and over the upper wall of the protective cap such that the protective cap is secured to said substrate by said thermoset plastic,wherein said upper wall of the molded plastic casing defines a plurality of openings disposed such that each of said nine SD contact pads is exposed through an associated one of the plurality of openings,wherein a rear edge of the integral molded plastic casing defines a rear opening, andwherein the eight microSD contact pins are disposed inside the chamber such that, when the microSD card is fully inserted through the rear opening into the chamber, eight contact pads on the microSD card are operably respectively connected to the eight microSD contact pins, whereby electrical signals generated by the microSD card on any of the eight contact pads are transmitted corresponding ones of the nine SD contact pads.
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Accused Products
Abstract
A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.
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Citations
22 Claims
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1. An adaptor card for adapting a micro-Secure Digital (microSD) card to communicate with a standard Secure Digital (SD) socket disposed on a host system, the adapter card comprising:
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a substrate forming a lower wall of the adaptor card, the substrate including a planar outside surface and an opposing inside surface, a front edge and an opposing rear edge; a lead frame structure fixedly connected to the inside surface of the substrate, the lead frame structure including; nine SD contact pads disposed on the substrate and located adjacent to the front edge of the substrate, the nine SD contact pads having respective contact surfaces facing away from the substrate and arranged in a standard SD pattern, eight microSD contact pins supported over the inside surface of the substrate and extending toward the rear edge of the substrate; and a plurality of connector wires respectively electrically connecting each of the eight microSD contact pins and an associated one of the nine SD contact pads; a protective cap mounted on the inside surface of the substrate, the protective cap including opposing side walls extending from the inside surface, and an upper wall supported by the side walls and disposed parallel to and spaced from a portion of the inside surface such that the opposing side walls, the upper wall and the inside surface portion define a chamber; and an integral molded plastic casing consisting essentially of a thermoset plastic and including an upper wall formed on the inside surface of the substrate and over the upper wall of the protective cap such that the protective cap is secured to said substrate by said thermoset plastic, wherein said upper wall of the molded plastic casing defines a plurality of openings disposed such that each of said nine SD contact pads is exposed through an associated one of the plurality of openings, wherein a rear edge of the integral molded plastic casing defines a rear opening, and wherein the eight microSD contact pins are disposed inside the chamber such that, when the microSD card is fully inserted through the rear opening into the chamber, eight contact pads on the microSD card are operably respectively connected to the eight microSD contact pins, whereby electrical signals generated by the microSD card on any of the eight contact pads are transmitted corresponding ones of the nine SD contact pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for producing an adaptor card for adapting a microSD card to communicate with an SD socket of a host system, the method comprising:
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forming an assembly including; a substrate having a planar outside surface and an opposing inside surface, a front edge and an opposing rear edge; and a lead frame structure fixedly connected to the inside surface of the substrate, the lead frame structure including; a plurality of standard Secure Digital (SD) contact pads disposed adjacent to the front edge of the substrate on the substrate and having respective contact surfaces facing away from the substrate, a plurality of micro-Secure Digital (microSD) contact pins supported over the inside surface of the substrate and extending toward the rear edge of the substrate; a plurality of connector wires respectively electrically connecting each of the plurality of microSD contact pins and an associated one of the plurality of standard SD contact pads; and a grip anchor pin supported over the inside surface of the substrate and extending toward the rear edge of the substrate, mounting a protective cap on the assembly such that opposing side walls and an upper wall of the protective cap define an chamber enclosing the eight microSD contact pins and the grip anchor pin; and molding thermoset plastic on the inside surface of the substrate, the protective cap, and at least a portion of the lead frame structure to form an integral molded plastic casing arranged such that said protective cap is secured to said substrate by said thermoset plastic and the nine SD contact pads are exposed through openings defined in the molded plastic casing, wherein the protective cap prevents formation of said thermoset plastic in the chamber enclosing the eight microSD contact pins and the grip anchor pin. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification