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TEMPERATURE-COMPENSATED MICRO-ELECTROMECHANICAL DEVICE, AND METHOD OF TEMPERATURE COMPENSATION IN A MICRO-ELECTROMECHANICAL DEVICE

  • US 20100107391A1
  • Filed: 01/07/2010
  • Published: 05/06/2010
  • Est. Priority Date: 10/08/2004
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • forming a first microstructure in a semiconductor substrate, including forming a first suspended mass that is coupled to the substrate so as to be movable with respect to the substrate; and

    forming a second microstructure of reference in the semiconductor substrate so that the first microstructure and the second microstructure undergo equal strains as a result of thermal expansions of the substrate, including forming a second suspended mass that is coupled to the substrate so as to be rigidly fixed to the substrate.

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