TEMPERATURE-COMPENSATED MICRO-ELECTROMECHANICAL DEVICE, AND METHOD OF TEMPERATURE COMPENSATION IN A MICRO-ELECTROMECHANICAL DEVICE
First Claim
1. A method, comprising:
- forming a first microstructure in a semiconductor substrate, including forming a first suspended mass that is coupled to the substrate so as to be movable with respect to the substrate; and
forming a second microstructure of reference in the semiconductor substrate so that the first microstructure and the second microstructure undergo equal strains as a result of thermal expansions of the substrate, including forming a second suspended mass that is coupled to the substrate so as to be rigidly fixed to the substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.
-
Citations
15 Claims
-
1. A method, comprising:
-
forming a first microstructure in a semiconductor substrate, including forming a first suspended mass that is coupled to the substrate so as to be movable with respect to the substrate; and forming a second microstructure of reference in the semiconductor substrate so that the first microstructure and the second microstructure undergo equal strains as a result of thermal expansions of the substrate, including forming a second suspended mass that is coupled to the substrate so as to be rigidly fixed to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method, comprising:
-
subjecting a sensor to an acceleration, the sensor having first microstructure and a second microstructure on a semiconductor substrate, the first microstructure having a first suspended mass that is coupled to the substrate so as to be movable with respect to the substrate, and the second microstructure having a second suspended mass that is rigidly fixed to the substrate, the first and second suspended masses being substantially symmetrical to each other; detecting, from the first microstructure, a first signal that includes an acceleration component and a temperature variation component; and detecting, from the second microstructure, a second signal that includes only a temperature variation component. - View Dependent Claims (9, 10, 11, 12)
-
-
13. A method, comprising:
-
detecting a change in value of a first capacitive coupling between a first body and a substrate, the change in value of the first capacitive coupling correlating at least in part to a degree of movement of the first body relative to the substrate; detecting a change in value of a second capacitive coupling between a second body and the substrate, the change in value of the second capacitive coupling correlating at least in part to a degree of influence of temperature on the first and second capacitive couplings; and deriving, from the changes in value of the first and second capacitive couplings, a temperature-corrected change in value of the first capacitive coupling, substantially correlating to the degree of movement of the first body relative to the substrate. - View Dependent Claims (14, 15)
-
Specification