PATTERNING ON SURFACE WITH HIGH THERMAL CONDUCTIVITY MATERIALS
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Abstract
The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
104 Citations
64 Claims
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1-44. -44. (canceled)
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45. A method of making high thermal conductivity paper comprising:
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adding high thermal conductivity materials and a solvent for the high thermal conductivity materials onto or within a substrate; evaporating the solvent such that the high thermal conductivity materials form a specific pattern on or within the substrate; and producing a paper product from the substrate. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52)
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53. A method of making high thermal conductivity paper comprising:
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adding high thermal conductivity materials onto at least one of a mica substrate or a mica paper product in a specific pattern; and prior to or after the adding the high thermal conductivity fillers, producing a paper product from the mica substrate. - View Dependent Claims (54, 55, 56, 57, 58, 59)
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60. A method of making high thermal conductivity paper comprising:
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patterning high thermal conductivity materials within a substrate in a specific pattern, wherein the high thermal conductivity materials comprise nanofillers; and producing a paper from the substrate such that the specific pattern is formed on an internal layer of the produced paper. - View Dependent Claims (61, 63, 64)
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Specification