METHODS FOR REMOVING A METAL OXIDE FROM A SUBSTRATE

• US 20100108491A1
• Filed: 01/07/2010
• Published: 05/06/2010
• Est. Priority Date: 09/27/2005
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Thie, William, Dordi, Yezdi, Bailey, Andrew D. III, Yoon, Hyungsuk Alexander
• Granted Patent: US 8,883,027 B2
• Time in Patent Office: Days
• US Class Current: 204/164
• CPC Class Codes: H01L 21/02063 the processing being the formation of vias or contact holes
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H05H 1/2406 using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
• CPC Class Codes: H05H 1/2418 the electrodes being embedded in the dielectric

Abstract

A method for generating plasma for removing metal oxide from a substrate is provided. The method includes providing a powered electrode assembly, which includes a powered electrode, a dielectric layer, and a wire mesh disposed between the powered electrode and the dielectric layer. The method also includes providing a grounded electrode assembly disposed opposite the powered electrode assembly to form a cavity wherein the plasma is generated. The wire mesh is shielded from the plasma by the dielectric layer when the plasma is present in the cavity, which has an outlet at one end for providing the plasma to remove the metal oxide. The method further includes introducing at least one inert gas and at least one process gas into the cavity. The method yet also includes applying an rf field to the cavity using the powered electrode to generate the plasma from the inert and the process gas.

Claims

1-9. -9. (canceled)

10. A method for generating a plasma for removing metal oxide from a substrate, comprising:

providing a powered electrode assembly, said powered electrode assembly including

a powered electrode,

a first dielectric layer, and

a first wire mesh disposed between said powered electrode and said first dielectric layer;

providing a grounded electrode assembly disposed opposite said powered electrode assembly so as to form a cavity wherein said plasma is generated, said first wire mesh being shielded from said plasma by said first dielectric layer when said plasma is present in said cavity, said cavity having an outlet at one end for providing said plasma to remove said metal oxide;

introducing at least one inert gas and at least one process gas into said cavity; and

applying an rf field to said cavity using said powered electrode to generate said plasma from said at least one inert and said at least one process gas.

11. The method of claim 10 wherein said grounded electrode assembly includes

a grounded electrode,

a second dielectric layer disposed between said grounded electrode and said plasma when said plasma is present in said cavity.

12. The method of claim 11 wherein said grounded electrode assembly further includes a second wire mesh disposed between said grounded electrode and said second dielectric layer, wherein said second wire mesh is shielded from said plasma by said second dielectric layer when said plasma is present in said cavity.

13. The method of claim 12 wherein said cavity is an annular volume.

14. The method of claim 13 wherein said powered electrode is a longitudinal probe configured in said cavity.

15. The method of claim 14 wherein said cavity has a cavity diameter along a lateral axis, wherein said cavity diameter is at least as large as a substrate diameter.

16. The method of claim 15 wherein at least one of said first dielectric layer and said second dielectric layer is one of silicon dioxide, silicon nitride, Mylar, ceramic, and Teflon

17. The method of claim 16, wherein at least one of said first wire mesh and said second wire mesh are one of copper, stainless steel, brass, and galvanized metal.

18. The method of claim 17, wherein at least one of said first wire mesh and said second wire mesh are configured as one of a monofilament, a rectangular weave, and a hexagon weave.

19. A method for generating a plasma for removing metal oxide from a substrate, comprising:

providing a powered electrode assembly, said powered electrode assembly including

a powered electrode,

a first dielectric layer, and

a first wire mesh disposed between said powered electrode and said first dielectric layer;

providing a grounded electrode assembly disposed opposite said powered electrode assembly so as to form a cavity wherein said plasma is generated, said first wire mesh being shielded from said plasma by said first dielectric layer when said plasma is present in said cavity, said cavity having an outlet at one end for providing said plasma to remove said metal oxide; and

applying an rf field to said cavity using said powered electrode to generate said plasma from at least one inert gas and said at least one process gas.

20. The method of claim 19 wherein said grounded electrode assembly includes

a grounded electrode,

a second dielectric layer disposed between said grounded electrode and said plasma when said plasma is present in said cavity.

21. The method of claim 20 wherein said grounded electrode assembly further includes a second wire mesh disposed between said grounded electrode and said second dielectric layer, wherein said second wire mesh is shielded form said plasma by said second dielectric layer when said plasma is present in said cavity.

22. The method of claim 21 wherein said cavity is an annular volume.

23. The method of claim 22 wherein said powered electrode is a longitudinal probe configured in said cavity.

24. The method of claim 23 wherein said cavity has a cavity diameter along a lateral axis, wherein said cavity diameter is at least as large as a substrate diameter.

25. The method of claim 24 wherein at least one of said first dielectric layer and said second dielectric layer is one of silicon dioxide, silicon nitride, Mylar, ceramic, and Teflon.

26. The method of claim 25 wherein at least one of said first wire mesh and said second wire mesh are one of copper, stainless steel, brass, and galvanized metal.

27. The method of claim 26 wherein at least one of said first wire mesh and said second wire mesh are configured as one of a monofilament, a rectangular weave, and a hexagon weave.

28. An article of manufacture comprising a program storage medium having computer readable code embodied therein, said computer readable code being configured to generate a plasma for removing metal oxide from a substrate, comprising:

computer readable code for providing a powered electrode assembly, said powered electrode assembly including

a powered electrode,

a first dielectric layer, and

a first wire mesh disposed between said powered electrode and said first dielectric layer;

computer readable code for providing a grounded electrode assembly disposed opposite said powered electrode assembly so as to form a cavity wherein said plasma is generated, said first wire mesh being shielded from said plasma by said first dielectric layer when said plasma is present in said cavity, said cavity having an outlet at one end for providing said plasma to remove said metal oxide;

computer readable code for introducing at least one inert gas and at least one process gas into said cavity; and

computer readable code for applying an rf field to said cavity using said powered electrode to generate said plasma from said at least one inert and said at least one process gas.

29. The article of manufacture of claim 28 wherein said grounded electrode assembly includes

a grounded electrode,

a second dielectric layer disposed between said grounded electrode and said plasma when said plasma is present in said cavity.