Integrated Tool for Fabricating an Electronic Component

• US 20100108636A1
• Filed: 06/29/2009
• Published: 05/06/2010
• Est. Priority Date: 10/30/2008
• Status: Abandoned Application

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Peng, Xilin, Qiu, Jiaoming, Kautzky, Michael Christopher, Kief, Mark Thomas, Chen, Yonghua
• Application Number:
  US12/493,468
• Publication Number:
  US 20100108636A1
• Time in Patent Office: Days
• US Class Current: 216/13
• CPC Class Codes: B82Y 25/00 Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
• CPC Class Codes: G01R 33/093 using multilayer structures, e.g. giant magnetoresistance sensors thin magnetic films H01F10/00
• CPC Class Codes: G11B 5/3116 Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks G11B5/3113, G11B5/245 take precedence
• CPC Class Codes: G11B 5/3163 Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
• CPC Class Codes: H01F 41/30 for applying nanostructures, e.g. by molecular beam epitaxy [MBE]

Abstract

A tool for use in fabricating an electronic component includes a plurality of processing modules and a transfer chamber in communication with each of the plurality of processing modules. The transfer chamber includes a component for transferring a structure to each of the plurality of processing modules. The plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum. The plurality of processing modules includes a first module configured to perform a first process on the structure and a second module configured to perform a second process on the structure. The first process includes performing at least one shaping operation on the structure.

Claims

1. A tool for use in fabricating an electronic component comprising:

a plurality of processing modules;

a transfer chamber in communication with each of the plurality of processing modules and having a robotically moveable arm for transferring a structure to each of the plurality of processing modules;

wherein the plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum, the plurality of processing modules including;

a first module configured to perform a first process, wherein the first process includes performing at least one shaping operation on the structure; and

a second module configured to perform a second process.

2. The tool of claim 1, further comprising an input load lock configured to receive the structure from the surrounding environment and an output load lock configured for sending the structure back into the surrounding environment after being processed by at least one of the plurality of processing modules, the robotically moveable arm configured to retrieve the structure from the input load lock and transfer the structure to one of the plurality of processing modules and the robotically moveable arm configured to retrieve the structure from one of the plurality of processing modules and transfer the structure to the output load lock.

3. The tool of claim 2, further comprising an alignment chuck, wherein when the robotically moveable arm retrieves the structure from the input load lock, the robotically moveable arm is configured to transfer the structure to the alignment chuck to align the structure prior to transferring the structure to one of the plurality of processing modules.

4. The tool of claim 1, further comprising a heating chuck, wherein the robotically moveable arm transfers the structure into the heating chuck to pre-heat the structure before the structure is transferred into one of the plurality of processing modules for processing.

5. The tool of claim 1, wherein the second process performed in the second module comprises a process of treating sidewalls of the structure using at least one of a cleaning treatment and a passivation treatment.

6. The tool of claim 5, wherein the plurality of processing modules further comprise a third module configured to perform a third process, wherein the third process includes forming a protective material on the structure such that the protective material is in contact at least some of the sidewalls of the structure.

7. The tool of claim 6, wherein the plurality of processing modules further comprise a fourth module configure to perform a fourth process, wherein the fourth process includes forming biasing material on the protective material that was formed on the structure with the third module.

8. The tool of claim 5, wherein the plurality of processing modules further comprise a third module configured to perform a third process, wherein the third process includes forming biasing material on the structure with the third module.

9. The tool of claim 1, wherein the second process performed in the second module comprises a process of forming a protective material on the structure such that the protective material is in contact at least some of the sidewalls of the structure.

10. The tool of claim 9, wherein the plurality of processing modules further comprise a third module configured to perform a third process, wherein the third process includes forming biasing material on the structure with the third module.

11. A method of fabricating an electronic component comprising:

forming a structure by depositing layered magnetic material on a substrate, the layered magnetic material including a trailing edge, a leading edge and a pair of opposing sidewalls extending between the trailing edge and the leading edge;

placing the structure in a tool, the tool including a plurality of processing modules and a transfer chamber in communication with each of the plurality of processing modules and having a component for transferring the structure to each of the plurality of processing modules, wherein the plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum;

transferring the structure from the transfer chamber into a first module of the plurality of processing modules, the first module configured to perform a first process on the structure, the first process including defining the structure by performing at least one shaping operation on the structure; and

transferring the structure from the first module to a second module of the plurality of processing modules, the second module configured to perform a second process on the structure.

12. The tool of claim 11, wherein the second process performed in the second module comprises treating the pair of opposing sidewalls of the structure using at least one of a cleaning treatment and a passivation treatment.

13. The tool of claim 12, further comprising transferring the structure from the second module to a third module of the plurality of processing modules, the third module configured to perform a third process on the structure, the third process including forming a protective material on the structure such that the protective material is in contact the pair of opposing sidewalls of the layered magnetic material.

14. The tool of claim 13, further comprising transferring the structure from the third module to a fourth module of the plurality of processing modules, the fourth module configure to perform a fourth process, the fourth process including forming biasing material on the protective material that was formed on the structure with the third module.

15. The tool of claim 12, further comprising transferring the structure from the second module to a third module of the plurality of processing modules, the third module configured to perform a third process on the structure, the third process including forming biasing material on the structure with the third module.

16. The tool of claim 11, wherein the second process performed in the second module comprises forming a protective material on the structure such that the protective material is in contact with the pair of opposing sidewalls of the layered magnetic material.

17. The tool of claim 16, further comprising transferring the structure from the second module to a third module of the plurality of processing modules, the third module configured to perform a third process on the structure, the third process including forming biasing material on the structure with the third module.

18. A tool for use in fabricating an electronic component comprising:

a plurality of processing modules;

a transfer chamber in communication with each of the plurality of processing modules and having a robotically moveable arm for transferring a structure to each of the plurality of processing modules, the structure including layered magnetic material formed on a substrate, the layered magnetic material including a trailing edge, a leading edge and a pair of opposing sidewalls extending between the trailing edge and the leading edge;

wherein the plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum, the plurality of processing modules including;

a first module configured to perform a first process on the structure, wherein the first process includes performing at least one shaping operation on the pair of opposing sidewalls of the layered magnetic device; and

a second module configured to perform a second process on the structure, wherein the second process includes depositing a protective material on at least the pair of opposing sidewalls of the layered magnetic device.

19. The tool of claim 18, wherein the first process utilizes one of a ion beam etching (IBE), reactive ion etching (RIE), reactive ion beam etch (RIBE) and inductively-coupled plasma (ICP) etch to perform the at least one shaping operation.

20. The tool of claim 18, wherein the second process utilizes one of a physical vapor deposition (PVD), ion beam deposition (IBD), atomic layer deposition (ALD), chemical vapor deposition (CVD), and plasma enhanced chemical vapor deposition (PECVD) to deposit the protective material on at the pair of opposing sidewalls of the layered magnetic device.