METHOD FOR THE SOLDERING REPAIR OF A COMPONENT IN A VACUUM AND AN ADJUSTED PARTIAL OXYGEN PRESSURE

• US 20100108745A1
• Filed: 02/15/2008
• Published: 05/06/2010
• Est. Priority Date: 03/06/2007
• Status: Active Grant

• Current Assignee: MTU Aero Engines GmbH (MTU)
• Original Assignee: MTU Aero Engines GmbH (MTU)
• Inventors: Heinz, Paul, Singer, Robert
• Granted Patent: US 7,874,473 B2
• Time in Patent Office: Days
• US Class Current: 228/119
• CPC Class Codes: B23K 1/0018 Brazing of turbine parts
• CPC Class Codes: B23K 1/008 Soldering within a furnace B23K1/012 takes precedence
• CPC Class Codes: B23K 1/206 Cleaning
• CPC Class Codes: B23K 2101/001 Turbines
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: B23K 35/304 with Cr as the next major constituent
• CPC Class Codes: C22C 19/05 with chromium
• CPC Class Codes: C22C 19/057 with the maximum Cr content being less 10%
• CPC Class Codes: F01D 5/005 Repairing methods or devices
• CPC Class Codes: F05D 2230/238 Soldering
• CPC Class Codes: Y02T 50/60 Efficient propulsion technologies, e.g. for aircraft
• CPC Class Codes: Y10T 29/49318 Repairing or disassembling

Abstract

A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.

Claims

1-16. -16. (canceled)

17. A method for a soldering repair of a component by a solder in a processing chamber, comprising the steps of:

adjusting an oxygen partial pressure of less than 3.5*10<sup>−

6</sup>mbar and greater than 10<sup>−

7</sup> mbar in the processing chamber; and

adjusting a total pressure of less than 10 mbar and greater than 0.035 mbar in the processing chamber.

18. The method according to claim 17, wherein prior to a heating of the component in the processing chamber with the solder a flushing of the processing chamber with an inert gas is performed.

19. The method according to claim 18, wherein a throughput during the flushing lies between 0.2 l/min and 1 l/min.

20. The method according to claim 19, wherein the throughput is 1 l/min.

21. The method according to claim 18, wherein an inert gas is filtered though a gas cleaning cartridge before entering the processing chamber.

22. The method according to claim 17, wherein the component features a nickel-based alloy.

23. The method according to claim 17, wherein the soldering is conducted isothermally.

24. The method according to claim 17, wherein the soldering is conducted in a temperature-gradient method.

25. The method according to claim 17, wherein the solder is directionally solidified.

26. The method according to claim 17, wherein the solder is nickel-based.

27. The method according to claim 26, wherein the solder features chromium, cobalt and tungsten.

28. The method according to claim 26, wherein the solder contains zirconium.

29. The method according to claim 26, wherein the solder contains scandium.

30. The method according to claim 26, wherein the solder contains zirconium and does not contain any scandium.

31. The method according to claim 26, wherein the solder contains scandium and does not contain any zirconium.

32. The method according to claim 26, wherein the solder contains zirconium and scandium.