Method and structure for forming a gyroscope and accelerometer
First Claim
1. A method for fabricating a micro electromechanical device, the method comprising:
- providing a first substrate including control circuitry, the first substrate having a top surface and a bottom surface;
forming an insulating layer on the top surface of the first substrate;
removing a first portion of the insulating layer so as to form a plurality of standoff structures;
bonding a second substrate to the first substrate, the second substrate having an upper surface and a lower surface;
thinning the second substrate to a predetermined thickness;
forming a plurality of trenches in the second substrate, each of the plurality of trenches extending to the top surface of the first substrate;
filling at least a portion of each of the plurality of trenches with a conductive material;
forming the micro electromechanical device in the second substrate; and
bonding a third substrate to the second substrate.
1 Assignment
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Accused Products
Abstract
A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.
114 Citations
26 Claims
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1. A method for fabricating a micro electromechanical device, the method comprising:
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providing a first substrate including control circuitry, the first substrate having a top surface and a bottom surface; forming an insulating layer on the top surface of the first substrate; removing a first portion of the insulating layer so as to form a plurality of standoff structures; bonding a second substrate to the first substrate, the second substrate having an upper surface and a lower surface; thinning the second substrate to a predetermined thickness; forming a plurality of trenches in the second substrate, each of the plurality of trenches extending to the top surface of the first substrate; filling at least a portion of each of the plurality of trenches with a conductive material; forming the micro electromechanical device in the second substrate; and bonding a third substrate to the second substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A micro-electromechanical device comprising;
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a CMOS substrate having an upper surface and a lower surface and including control circuitry disposed in an upper portion of the CMOS substrate; a plurality of posts coupled to the upper surface of the CMOS substrate and extending in a direction normal to the upper surface of the CMOS substrate;
each of the plurality of posts having a bonding region;a second substrate bonded to the plurality of posts, wherein the second substrate has a top surface and a bottom surface in contact with the bonding region of each of the plurality of posts and wherein at least a portion of the micro-electromechanical device is disposed in the second substrate; a plurality of trenches extending from the top surface of the second substrate to the upper surface of the CMOS substrate, the trenches passing through the plurality of posts; and a cover substrate bonded to the top surface of the second substrate, wherein the cover substrate includes a recessed region overlaying the at least a portion of the micro-electromechanical device. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method for fabricating a micro electromechanical device, the method comprising:
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providing a first substrate including control circuitry, the first substrate having a first surface and an opposing second surface; providing a second substrate having a top surface and a bottom surface; removing a portion of the second substrate along the bottom surface to form a plurality of standoff structures; bonding the first substrate to the second substrate, wherein the first surface of the first surface is in contact with the standoff structures of the second substrate; thinning the second substrate to a predetermined thickness, the thinning comprising removing a portion of the second substrate along the top surface of the second substrate; forming a plurality of trenches in the second substrate, the plurality of trenches extending from the top surface of the second substrate to the first surface of the first substrate; forming a portion of one or more micro electromechanical devices in the second substrate; and bonding a third substrate to the second substrate - View Dependent Claims (15, 16, 17, 18)
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19. A method of fabricating a device, the method comprising:
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providing a CMOS substrate having one or more electrodes and control circuitry formed in proximity to a first surface; forming a first photosensitive layer over the first surface of the CMOS substrate; patterning and etching the first photosensitive layer to form a first trench, the first trench extending to a first electrode from among the one or more electrodes; removing a remaining portion of the first photosensitive layer; forming a second photosensitive layer over the first substrate, wherein a portion of the second photosensitive layer overlays the first trench; etching the second photosensitive layer and a portion of the first substrate to define a plurality of standoff structures; attaching a second substrate to the first substrate, the second substrate having an upper surface and a lower surface; thinning the second substrate to a predetermined thickness; forming a third photosensitive layer over the upper surface of the second substrate; etching the third photosensitive layer and a portion of the second substrate to define a second trench;
the second trench being aligned with the first trench, wherein the second trench merges with the first trench to form a continuous trench extending from the upper surface of the second substrate to the first electrode;forming a conformal adhesion layer over the upper surface of the second substrate and over sidewalls of the continuous trench; forming a conformal barrier layer over the adhesion layer; filling the continuous trench with a conductive material; forming a passivation layer over the barrier layer; and patterning and etching a portion of the second substrate to form a micro-electromechanical device. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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Specification