SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device formed by stacking a plurality of LSI chips, the semiconductor device comprising:
- a first LSI chip including a transmitter circuit of electromagnetic signals;
a second LSI chip including a receiver circuit of electromagnetic signals; and
an interposer including a first inductor inductively coupled with the transmitter circuit of the first LSI chip and a second inductor inductively coupled with the receiver circuit of the second LSI chip, the first inductor and the second inductor being electrically connected to each other, whereinan interchip communication is performed from the first LSI chip to the second LSI chip.
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Accused Products
Abstract
A highly flexible semiconductor device of a stacked-type semiconductor device which transfers information by inductive coupling between inductors, in which LSI chips can be stacked even when a transmitter circuit and a receiver circuit are arranged at different positions from each other when viewed in a stacking direction. The semiconductor device has an interposer including a first inductor which is inductively coupled with a transmitter circuit of a first LSI chip to be stacked, and a second inductor which is inductively coupled with a receiver circuit of a second LSI chip to be stacked, the first inductor and the second inductor being electrically connected. An interchip communication is made from the first LSI chip to the second LSI chip.
20 Citations
18 Claims
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1. A semiconductor device formed by stacking a plurality of LSI chips, the semiconductor device comprising:
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a first LSI chip including a transmitter circuit of electromagnetic signals; a second LSI chip including a receiver circuit of electromagnetic signals; and an interposer including a first inductor inductively coupled with the transmitter circuit of the first LSI chip and a second inductor inductively coupled with the receiver circuit of the second LSI chip, the first inductor and the second inductor being electrically connected to each other, wherein an interchip communication is performed from the first LSI chip to the second LSI chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification
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- Resources
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Current AssigneeHitachi, Ltd.
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Original AssigneeHitachi, Ltd.
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InventorsTSUNODA, Takanobu, ITO, KIYOTO, HOSOGI, Koji
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Granted Patent
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Time in Patent OfficeDays
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Field of Search
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US Class Current257/660
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CPC Class CodesH01L 2225/06527 Special adaptation of elect...H01L 2225/06572 Auxiliary carrier between d...H01L 25/0657 Stacked arrangements of dev...H01L 2924/00 Indexing scheme for arrange...H01L 2924/0002 Not covered by any one of g...
