ELECTROSTATIC CHUCK HAVING REDUCED ARCING
First Claim
1. An electrostatic chuck for retaining a substrate, comprising:
- an electrically conductive body having one or more channels formed in an upper surface thereof;
a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized;
one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and
a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon.
1 Assignment
0 Petitions
Accused Products
Abstract
Electrostatic chucks and methods of manufacturing the same are provided herein. In some embodiments, an electrostatic chuck comprises an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon.
44 Citations
22 Claims
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1. An electrostatic chuck for retaining a substrate, comprising:
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an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus for processing a substrate, comprising:
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a chamber defining a process region; an electrostatic chuck for retaining a substrate in the process region, the electrostatic chuck comprising; an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon. - View Dependent Claims (13, 14, 15)
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16. A method of making an electrostatic chuck, comprising:
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providing a body having one or more channels formed in an upper surface thereof; anodizing the one or more channels; providing a plate having one or more fluid passages disposed therethrough and having a lower surface portion that, when positioned within the one or more channels, defines one or more plenums that are each fluidly coupled to at least some of the one or more fluid passages; anodizing interior surfaces of the one or more fluid passages and the lower surface portion; and inserting the anodized plate into the one or more anodized channels of the body to form the one or more plenums. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification