ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20100109516A1
• Filed: 03/13/2008
• Published: 05/06/2010
• Est. Priority Date: 03/29/2007
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Sonoda, Shinichiro, Shimotsu, Shinichi, Goto, Chiaki, Warashina, Hidenaga
• Application Number:
  US12/593,545
• Publication Number:
  US 20100109516A1
• Time in Patent Office: Days
• US Class Current: 313/504
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133311 Environmental protection, e.g. against dust or humidity
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 2202/28 Adhesive materials or arrangements
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8721 Metallic sealing arrangements

Abstract

In a method for manufacturing an electronic device, a low melting point metal layer is provided to seal an electronic element between a pair of resin substrates each having a barrier layer laminated thereon. The low melting point metal layer bonds the barrier layers of the resin substrates to each other. The method includes the steps of: providing a light absorbing layer between at least one of the barrier layers and the low melting point metal layer; and irradiating a laser beam having a wavelength within a range from 350 nm to 600 nm onto the light absorbing layer through at least one of the resin substrates and the barrier layer laminated thereon, to heat and fuse the low melting point metal layer, thereby bonding the barrier layers to each other.

Claims

1. An electronic device, comprising:

a pair of resin substrates;

barrier layers laminated on each of the pair of resin substrates;

an electronic element formed on one of the barrier layers;

low melting point metal layers for bonding the pair of resin substrates together, provided at the peripheries of the barrier layers so as to surround the electronic element; and

a light absorbing layer provided between at least one of the barrier layers and one of the low melting point metal layers.

2. An electronic device as defined in claim 1, wherein:

the electronic element includes organic materials.

3. A method for manufacturing an electronic device, in which a low melting point metal layer is provided to seal an electronic element between a pair of resin substrates each having a barrier layer laminated thereon, and the low melting point layer bonds the barrier layers of the resin substrates to each other, comprising the steps of:

providing alight absorbing layer between at least one of the barrier layers and the low melting point metal layer; and

irradiating a laser beam having a wavelength within a range from 350 nm to 600 nm onto the light absorbing layer through at least one of the resin substrates and the barrier layer laminated thereon, to heat and fuse the low melting point metal layer, thereby bonding the barrier layers to each other.

4. An electronic device as defined in claim 3, wherein:

the electronic element includes organic materials.