Light Source Package

• US 20100109551A1
• Filed: 12/01/2009
• Published: 05/06/2010
• Est. Priority Date: 10/31/2007
• Status: Active Grant

• Current Assignee: Evergrande Holdings Limited
• Original Assignee: Yu-Nung Shen
• Inventors: Shen, Yu-Nung
• Granted Patent: US 8,337,048 B2
• Time in Patent Office: Days
• US Class Current: 315/287
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 23/003 the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/58 characterised by the coolants
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A light source package includes a metal base adapted for engaging a suitable electrical socket; a transparent housing assembled with the base so as to form together with the base an accommodating space; and a light-emitting unit mounted within the accommodating space. The light-emitting unit has an LED die, and the LED die is operatively disposed in the accommodating space such that the light emitted from all of the six surfaces of the LED die is completely collected for illumination.

Claims

1. A light source package, comprising:

a metal base adapted for engaging an electrical socket;

a transparent housing assembled with the base so as to form together with the base an accommodating space; and

a light-emitting unit mounted within the accommodating space and comprising a light-emitting diode die, the light-emitting diode die having six light-emitting surfaces and being operatively disposed in the accommodating space such that the light emitted from all of the six surfaces of the light-emitting diode die is completely collected for illumination.

2. The light source package according to claim 1, wherein the light-emitting unit further comprises:

a pair of conductive electrodes mounted on the base, each having a first conductive terminal and a second conductive terminal, wherein the first conductive terminal of one of the conductive electrodes is electrically connected to a positive contact of the base, whereas the first conductive terminal of the other conductive electrode is electrically connected to a negative contact of the base; and

a reflective cup insulatively sleeved on the pair of conductive electrodes at a position proximal to the second conductive terminals of the conductive electrodes;

wherein the light-emitting diode die has a first surface, among the six light-emitting surfaces, provided with a first electrode and a second surface, among the six light-emitting surfaces, provided with a second electrode, wherein the first electrode and the second electrode are electrically connected to the second conductive terminals of the conductive electrodes, respectively, such that the light-emitting diode die is supported in position by the conductive electrodes.

3. The light source package according to claim 2, wherein the first surface and the second surface of the light-emitting diode die are each coated with a heat dissipating film.

4. The light source package according to claim 3, wherein the heat dissipating films are made of material having a thermal conductivity between 800 to 1200 W/(m·

K).

5. The light source package according to claim 3, wherein a phosphor layer is coated on the heat dissipating films and four side surfaces of the light-emitting diode die.

6. The light source package according to claim 2, further comprising a capacitor electrically coupled between the conductive electrodes and a current limiting resistor and a diode connected in series with one of the conductive electrodes, such that the base is enabled to directly engage a socket of and receive power from an alternate current power source.

7. The light source package according to claim 1, further comprising a non-conductive, heat-dissipating fluid filled within the accommodating space.

8. The light source package according to claim 7, wherein the non-conductive, heat-dissipating fluid is selected from the group consisting of heat-dissipating oils, pure water and gases suitable for the heat-dissipating purpose.

9. A light source package, comprising:

a mounting substrate which is a transparent substrate with high thermal conductivity and has a mounting surface overlaid with predetermined circuit traces;

a light-emitting diode die mounted on the mounting surface of the mounting substrate and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the circuit traces on the substrate via a first wire;

a heat pipe having a through hole, wherein the heat pipe is attached onto the substrate in such a manner that the light-emitting diode die mounted on the substrate is seated within the through hole of the heat pipe, and wherein the second electrode of the light-emitting diode die is connected to the heat pipe via a second wire; and

a phosphor layer filled within the through hole of the heat pipe, so as to cover the light-emitting diode die.

10. A light source package, comprising:

an elongated heat pipe having an end portion; and

a plurality of light-emitting diode dies flip-chip mounted on the end portion of the heat pipe.

11. A light source package, comprising:

a cup-like casing having a closed bottom portion and an open top portion disposed oppositely to the bottom portion;

a heat-dissipating layer formed on an inner surface of the cup-like casing;

a thermal conductive layer coated on the heat-dissipating layer;

a reflective layer formed on the thermal conductive layer; and

a light-emitting unit comprising a mounting substrate located on the reflective layer in an interior of the cup-like casing, an light-emitting diode die flip-chip mounted on the substrate, and a circuit device located on an exterior of the cup-like casing and adapted for controlling power supply to the light-emitting diode die.

12. The light source package according to claim 11, wherein the casing is made by sintering a ceramic material doped with iron powder.

13. The light source package according to claim 11, wherein the heat-dissipating layer is made by a material having a thermal conductivity between 400 W/(m·

K) to 700 W/(m·

K).

14. The light source package according to claim 11, wherein the thermal conductive layer is made by a material having a thermal conductivity between 800 to 1200 W/(m·

K).

15. The light source package according to claim 11, wherein the reflective layer is formed by electroplating or plasma-coating a layer of metallic or non-metallic material.

16. The light source package according to claim 11, wherein the mounting substrate further comprises a pair of conductive pins extending outwardly through the bottom portion of the casing, wherein each of the conductive pins has a connecting end electrically connected to predetermined circuit traces on the mounting substrate and a free end exposed outside the bottom portion of the casing and adapted for engaging a socket of an external power supplying device.

17. The light source package according to claim 16, wherein the circuit device for controlling power supply includes an AC/DC converting circuit and a constant current circuit, wherein the AC/DC converting circuit has an input terminal electrically connected to the conductive pins, and wherein the constant current circuit includes an input terminal electrically connected to an output terminal of the AC/DC converting circuit and an output terminal electrically connected to the light-emitting diode die.

18. The light source package according to claim 11, wherein the circuit device for controlling power supply further comprises a pulse width modulation (PWM) circuit for controlling the output of the constant current circuit.

19. The light source package according to claim 11, wherein the casing is provided on its outer surface with a plurality of ribs extending in radial directions, wherein the ribs are made by sintering a metallic material of high thermal conductivity with or without a ceramic material.