Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same

• US 20100109966A1
• Filed: 12/31/2008
• Published: 05/06/2010
• Est. Priority Date: 10/31/2008
• Status: Abandoned Application

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Zhao, Yanzhu, Gordon, Charles R., Yamamoto, Joyce K., Hossick-Schott, Joachim, Hill, Gerard J., Farlow, Charles S., Wentink, Robert S., Barror, Michael William, Mateychuk, Duane N.
• Application Number:
  US12/347,597
• Publication Number:
  US 20100109966A1
• Time in Patent Office: Days
• US Class Current: 343/841
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 3/24 varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the monolithic structure. Superstrate dielectric layers formed above the antenna may provide improved matching gradient with the surrounding environment to mitigate energy reflection effects. A outermost biocompatible layer is positioned over the superstrates as an interface with the surrounding environment. A shielding layer is positioned under the antenna to provide electromagnetic shielding for the IMD circuitry. Substrate dielectric layers formed below the antenna may possess higher dielectric values to allow the distance between the antenna and ground shielding layer to be minimized. An electromagnetic bandgap layer may be positioned between the antenna and the shielding layer. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure.

Claims

1. An antenna for an implantable medical device (“

IMD”

), comprising;

a structure derived from a plurality of discrete dielectric layers; and

an antenna conductor embedded within the structure within the plurality of dielectric layers,

wherein the structure is derived from a plurality of the dielectric layers being formed over the antenna conductor as superstrates that include gradually changing dielectric values as the dielectric layers move away from the antenna conductor to provide a matching gradient between the antenna conductor and an environment surrounding the antenna.

2. The antenna of claim 1, further comprising an outermost layer of biocompatible material formed over the superstrate dielectric layers.

3. The antenna of claim 1, further comprising a shielding layer positioned under the antenna conductor for providing electromagnetic shielding between the antenna conductor and the IMD to which the antenna is connected.

4. The antenna of claim 3, further comprising a layer of electromagnetic bandgap material positioned between the antenna conductor and the shielding layer.

5. The antenna of claim 1, wherein the structure is partially derived from a plurality of the dielectric layers being formed under the antenna conductor as substrates of high dielectric materials that allow the distance between the antenna conductor and the shielding layer to be minimized.

6. The antenna of claim 1, wherein at least one of the plurality of dielectric layers includes metamaterials to produce a negative effective permittivity or permeability for such at least one dielectric layer including the metamaterials.

7. The antenna of claim 1, further comprising:

at least one additional antenna conductor embedded within the structure; and

a switching device operatively connected to each of the antenna conductors for allowing desired ones of the antenna conductors to be selected for use in the antenna.

8. The antenna of claim 7, further comprising a plurality of antenna conductors embedded within the structure with each antenna conductor being formed on a separate respective dielectric layer.

9. The antenna of claim 7, further comprising a plurality of antenna conductors embedded within the structure with each antenna conductor being formed on the same dielectric layer.

10. The antenna of claim 1, wherein at least one of the dielectric layers comprises a ceramic material.

11. The antenna of claim 10, wherein the dielectric layers and the antenna conductor are part of a monolithic structure that has been co-fired together.

12. The antenna of claim 1, wherein at least one of the dielectric layers comprises a low temperature co-fire ceramic (LTCC) material having a melting point between about 850°

C. and 1150°

C. and a cofireable paste having a high dielectric constant.

13. The antenna of claim 1, wherein at least one of the dielectric layers comprises a high temperature co-fire ceramic (HTCC) material having a melting point between about 1100°

C. and 1700°

C.

14. The antenna of claim 1, wherein the antenna conductor is formed from a biocompatible conductive material.

15. A method for fabricating an antenna for an implantable medical device (“

IMD”

), comprising;

depositing a biocompatible conductive material over a dielectric layer;

depositing a plurality of discrete dielectric layers over the biocompatible conductive material, wherein the dielectric layers are formed over the biocompatible conductive material as superstrates that include gradually changing dielectric values as the dielectric layers move away from the biocompatible conductive material to provide a matching gradient between the antenna conductor and an environment surrounding the antenna; and

co-firing the dielectric layers and biocompatible conductive material together into a monolithic structure, wherein the biocompatible conductive material resulting in the co-fired monolithic structure serves as an antenna conductor.

16. The method of claim 15, further comprising depositing an outermost layer of biocompatible material over the superstrate dielectric layers prior to co-firing the layers together.

17. The method of claim 15, further comprising depositing a shielding layer of a metalized material as a layer under the antenna conductor biocompatible conductive material for providing electromagnetic shielding between the antenna conductor and the IMD to which the antenna is to be connected.

18. The method of claim 17, further comprising depositing a layer of electromagnetic bandgap material between the antenna conductor biocompatible conductive material and the shielding layer prior to co-firing the layers together.

19. The method of claim 17, further comprising depositing a plurality of the dielectric layers that are formed under the antenna conductor biocompatible conductive material and serve as substrates of high dielectric materials that allow the distance between the antenna conductor biocompatible conductive material and the shielding layer to be minimized.

20. The method of claim 15, further comprising forming at least one of the plurality of dielectric layers to metamaterials to produce a negative effective permittivity or permeability for such at least one dielectric layer including the metamaterials.

21. The method of claim 15, further comprising:

depositing the biocompatible conductive material over different portions of a dielectric layer to form different antenna conductors on the same dielectric layer prior to co-firing the layers together;

operatively connecting a switching device to each of the antenna conductors for allowing desired ones of the antenna conductors to be selectable for use in the antenna.

22. The method of claim 15, further comprising:

depositing the biocompatible conductive material over different respective dielectric layers to form different antenna conductors on a plurality of dielectric layers prior to co-firing the layers together;

operatively connecting a switching device to each of the antenna conductors for allowing desired ones of the antenna conductors to be selectable for use in the antenna.

23. The method of claim 15, wherein at least one of the dielectric layers comprises a ceramic material.

24. The method of claim 23, wherein at least one of the dielectric layers comprises a low temperature co-fire ceramic (LTCC) material having a melting point between about 850°

C. and 1150°

C., the method further comprising co-firing the layers together at a temperature between about 850°

C. and 1150°

C.

25. The method of claim 23, wherein at least one of the dielectric layers comprises a high temperature co-fire ceramic (HTCC) material having a melting point between about 1100°

C. and 1700°

C., the method further comprising co-firing the layers together at a temperature between about 1100°

C. and 1700°

C.

26. An antenna for an implantable medical device (“

IMD”

), comprising;

an antenna conductor, and

a superstrate material positioned over the antenna conductor having a gradually changing dielectric value to provide a matching gradient between the antenna conductor and an environment surrounding the antenna in a radiating direction for the antenna.

27. The antenna of claim 26, wherein the superstrate material is formed on the antenna conductor by an anodization process.

28. The antenna of claim 26, wherein the superstrate material is derived from a plurality of the dielectric layers being formed over the antenna conductor as superstrates that include gradually changing dielectric values as the dielectric layers move away from the antenna conductor.

29. The antenna of claim 26, further comprising a high impedance layer positioned between the antenna conductor and a grounding surface.