POWER SUPPLY APPARATUS

• US 20100110641A1
• Filed: 10/07/2009
• Published: 05/06/2010
• Est. Priority Date: 10/31/2008
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Okahashi, Tetsuhide
• Application Number:
  US12/574,973
• Publication Number:
  US 20100110641A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A power supply apparatus includes a printed circuit board having the longitudinal direction and including first and second regions where AC and DC circuit components are mounted respectively. A first heat dissipation plate and a second heat dissipation plate provided to stand respectively in the first and second regions each include, as seen in a plan view, a linear first straight portion and two second straight portions extending respectively from the two ends of the first straight portion in opposite directions respectively and in the longitudinal direction. Respective first straight portions of the first and second heat dissipation plates are opposite to each other, and one of the second straight portions of the first heat dissipation plate and one of the second straight portions of the second heat dissipation plate are partially opposite to each other.

Claims

1. A power supply apparatus for converting alternating current to direct current, comprising:

a printed circuit board including a first region where an alternating current circuit component is mounted and a second region where a direct current circuit component is mounted, and having a longitudinal direction;

a first heat dissipation plate provided to stand in said first region on said printed circuit board; and

a second heat dissipation plate provided to stand in said second region on said printed circuit board,

said first heat dissipation plate and said second heat dissipation plate each having a linear first straight portion and two second straight portions extending respectively from two ends of said first straight portion in respective directions opposite to each other as seen in a plan view, and

at least a part of said first straight portion of said first heat dissipation plate and at least a part of said first straight portion of said second heat dissipation plate being opposite to each other, at least a part of one of said second straight portions of said first heat dissipation plate and at least a part of one of said second straight portions of said second heat dissipation plate being opposite to each other, and said second straight portions each being placed in said longitudinal direction of said printed circuit board.

2. The power supply apparatus according to claim 1, wherein

said first heat dissipation plate is electrically connected to a heat generating component placed in said first region, and said second heat dissipation plate is electrically connected to a heat generating component placed in said second region.

3. The power supply apparatus according to claim 1, wherein

an opening is provided at an end abutting on said printed circuit board, of at least one of said first heat dissipation plate and said second heat dissipation plate, and said opening is located at a position corresponding to a position where a circuit pattern is formed on a rear surface of said printed circuit board.

4. The power supply apparatus according to claim 1, wherein

said first heat dissipation plate has a potential equal to a ground potential of said first region on said printed circuit board, and said second heat dissipation plate has a potential equal to a ground potential of said second region on said printed circuit board.

5. The power supply apparatus according to claim 1, wherein

insert portions are provided at respective ends abutting on said printed circuit board, of said first heat dissipation plate and said second heat dissipation plate, respectively,

holes are formed in said printed circuit board at respective positions corresponding to said insert portions, respectively, and

said first heat dissipation plate and said second heat dissipation plate are installed on said printed circuit board by latching together respective said insert portions and corresponding said holes, respectively.

6. The power supply apparatus according to claim 5, wherein

said insert portions are formed of respective insert members separate from and smaller in thickness than said first heat dissipation plate and said second heat dissipation plate, respectively, and

said first heat dissipation plate and said second heat dissipation plate are joined respectively to corresponding said insert members in such a manner that respective insert portions of said insert members extend from respective ends abutting on said printed circuit board, of said first heat dissipation plate and said second heat dissipation plate, respectively.

7. The power supply apparatus according to claim 1, wherein

a noise generating component generating electromagnetic noise is placed in a region on said printed circuit board, and said region is enclosed by respective said first straight portions of said first heat dissipation plate and said second heat dissipation plate and said one of said second straight portions of said first heat dissipation plate and said one of said second straight portions of said second heat dissipation plate.