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Soldering Strategies for Printed Circuit Board Assemblies

  • US 20100110650A1
  • Filed: 10/31/2008
  • Published: 05/06/2010
  • Est. Priority Date: 10/31/2008
  • Status: Abandoned Application
First Claim
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1. A printed circuit board assembly comprising,a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces, the printed circuit board supporting on the first outer surface at least one electronic component having a plurality of leads, the printed circuit board further including a plurality of through-hole clusters, wherein each through-hole cluster is associated with a respective lead and includes a central hole portion and a plurality of adjacent hole portions, wherein a plurality of solder joints are formed, wherein each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces.

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