Soldering Strategies for Printed Circuit Board Assemblies
First Claim
1. A printed circuit board assembly comprising,a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces, the printed circuit board supporting on the first outer surface at least one electronic component having a plurality of leads, the printed circuit board further including a plurality of through-hole clusters, wherein each through-hole cluster is associated with a respective lead and includes a central hole portion and a plurality of adjacent hole portions, wherein a plurality of solder joints are formed, wherein each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces.
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Accused Products
Abstract
Disclosed herein is a method for forming solder joints including providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces. The printed circuit board supports on the first outer surface at least one electronic component having a plurality of leads, and further includes a plurality of through-hole clusters. Each through-hole cluster is associated with a single lead and includes a central hole portion surrounded by a plurality of other hole portions. A plurality of solder joints is formed by subsequently moving the printed circuit board over a wave soldering tank filled with solder. Each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces. Each solder joint is formed by solder which is wicked up by the through-hole cluster to extend from the second surface to the first surface.
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Citations
20 Claims
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1. A printed circuit board assembly comprising,
a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces, the printed circuit board supporting on the first outer surface at least one electronic component having a plurality of leads, the printed circuit board further including a plurality of through-hole clusters, wherein each through-hole cluster is associated with a respective lead and includes a central hole portion and a plurality of adjacent hole portions, wherein a plurality of solder joints are formed, wherein each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces.
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13. A power control or conversion device comprising,
a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of copper pads, the printed circuit board supporting on the first outer surface at least one electronic component having a plurality of leads, the printed circuit board further including a plurality of through-hole clusters, wherein each through-hole cluster is associated with a single respective lead and includes a central hole and a plurality of surrounding holes, wherein a plurality of solder joints are formed by a wave soldering process, wherein each solder joint is formed between a respective lead inserted in the central hole of a respective through-hole cluster and a corresponding one of the plurality of copper pads.
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16. A method for wave soldering at least one electronic component to a printed circuit board, the method comprising:
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providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces, the printed circuit board supporting on the first outer surface at least one electronic component having a plurality of leads, the printed circuit board further including a plurality of through-hole clusters, wherein each through-hole cluster is associated with a respective lead and includes a central hole portion surrounded by a plurality of other hole portions, and forming a plurality of solder joints by subsequently moving the printed circuit board over a wave soldering tank filled with solder, each solder joint formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces, wherein each solder joint is formed by solder which is wicked up by the through-hole cluster. - View Dependent Claims (17, 18, 19, 20)
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Specification