METHOD OF FORMING ULTRA-SHALLOW JUNCTIONS FOR SEMICONDUCTOR DEVICES

• US 20100112795A1
• Filed: 09/30/2009
• Published: 05/06/2010
• Est. Priority Date: 08/30/2005
• Status: Abandoned Application

• Current Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Original Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Inventors: DIETZ, James A., KAIM, Robert, ARNO, Jose I.
• Application Number:
  US12/570,995
• Publication Number:
  US 20100112795A1
• Time in Patent Office: Days
• US Class Current: 438/515
• CPC Class Codes: H01J 2237/0827 for producing different ions sequentially
• CPC Class Codes: H01J 37/08 Ion sources; Ion guns
• CPC Class Codes: H01J 37/3171 for ion implantation plasma immersion ion implantation H01J37/32412
• CPC Class Codes: H01L 21/26506 in group IV semiconductors
• CPC Class Codes: H01L 21/26513 of electrically active species
• CPC Class Codes: H01L 21/2654 in AIIIBV compounds
• CPC Class Codes: H01L 21/26546 of electrically active species
• CPC Class Codes: H01L 21/26566 of a cluster, e.g. using a gas cluster ion beam
• CPC Class Codes: H01L 21/2658 of a molecular ion, e.g. decaborane

Abstract

A first method for producing a doped region in a semiconductor substrate includes performing a first implant step in which a carborane cluster molecule is implanted into a semiconductor substrate to form a doped region. A second method for producing a semiconductor device having a shallow junction region includes providing a first gas and a second gas in a container. The first gas includes a first dopant and the second gas includes a second dopant. The second method also includes implanting the first and second dopants into a semiconductor substrate using an ion. The ion source is not turned off between the steps of implanting the first dopant and implanting the second dopant.

Claims

1. A method for producing a doped region in a semiconductor substrate comprising performing a first implant step in which a carborane cluster molecule is implanted into a semiconductor substrate to form a doped region.

2. The method of claim 1, wherein the carborane cluster molecule is a o-carborane molecule having the general formula 1,2-C₂B₁₀H₁₂;

or the carborane cluster molecule is selected from a group consisting of 1,5-C₂B₃H₅, 1,2-C₂B₄H₆, 1,2-C₂B₅H₇ and 1,2-C₂B₈H₁₀;

or the carborane cluster molecule is a o-carborane derivative;

or the o-carborane derivative comprises a fluorinated carborane derivative;

or the carborane cluster molecule is selected from a group consisting of CB₅H₉, C₂B₄H₈, C₃B₃H₇, C₄B₂H₆, C₂B₃H₇, C₂B₇H₁₃, C₂B₃H₅, C₂B₄H₆, C₂B₅H₇, CB₅H₇, C₂B₆H₈, C₂B₇H₉, C₂B₈H₁₀, C₂B₉H₁₁, and C₂B₁₀H₁₂ or derivatives thereof.

3. The method of claim 1, further comprising performing a second implant step in which a dopant species is implanted into the semiconductor substrate.

4. The method of claim 3, wherein the dopant species is not boron or carbon.

5. The method of claim 3, wherein the dopant species comprises carbon.

6. The method of claim 3, wherein the dopant species comprises boron.

7. The method of claim 3, wherein the second implant step comprises implanting a cluster molecule into the substrate that is different from the carborane cluster molecule implanted in the first implant step.

8. The method of claim 1, further comprising annealing to activate at least one of the first dopant and the second dopant.

9. An apparatus for forming doped regions in a semiconductor substrate comprising a stage for holding a semiconductor substrate and means for implanting a carborane cluster molecule into the semiconductor substrate to form a doped region, wherein the carborane cluster molecule is a o-carborane molecule having the general formula 1,2-C₂B₁₀H₁₂;

or the carborane cluster molecule is selected from a group consisting of 1,5-C₂B₃H₅, 1,2-C₂B₄H₆, 1,2-C₂B₅H₇ and 1,2-C₂B₈H₁₀;

or the carborane cluster molecule is a o-carborane derivative.

10. A method for producing a semiconductor device having a shallow junction region, the method comprising:

providing a first gas and a second gas in a container, the first gas comprising a first dopant and the second gas comprising a second dopant;

implanting the first dopant into a semiconductor substrate using an ion source; and

implanting the second dopant into the semiconductor substrate using the ion source;

wherein the ion source is not turned off between the steps of implanting the first dopant and implanting the second dopant.

11. The method of claim 10, wherein at least one of the first gas and the second gas is CH₃;

or at least one of the first gas and the second gas is BF₃.

12. The method of claim 10, further comprising implanting a third dopant into the semiconductor substrate after implanting the second dopant using the ion source, wherein the ion source is not turned off between the step of implanting the second dopant and implanting the third dopant.

13. The method of claim 12, wherein the third dopant is included in at least one of the first gas and the second gas.

14. The method of claim 12, wherein the first dopant is carbon, the second dopant is fluorine, and the third dopant is boron.

15. The method of claim 12, wherein the third dopant is implanted to a lesser depth than at least one of the first dopant and the second dopant.

16. The method of claim 10, further comprising providing a third gas in the container with the first gas and the second gas.

17. The method of claim 16, wherein the first gas is a carbon source gas, the second gas is a fluorine source gas, and the third gas is a boron source gas.

18. The method of claim 16, wherein at least one of the first gas, the second gas, and the third gas acts as a source for a dopant species selected from the group consisting of phosphorous, arsenic, indium, and antimony.

19. The method of claim 10, wherein the first dopant is carbon and the second dopant is boron.

20. The method of claim 10, wherein the first dopant is fluorine and the second dopant is boron.

21. The method of claim 10, wherein one of the first dopant and the second dopant is fluorine and other of the first dopant and the second dopant is boron.

22. The method of claim 10, further comprising annealing to activate at least one of the first dopant and the second dopant to form a shallow junction, wherein at least one of the first dopant and the second dopant act to restrain boron diffusion.