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Substrate temperature control by using liquid controlled multizone substrate support

  • US 20100116788A1
  • Filed: 11/12/2008
  • Published: 05/13/2010
  • Est. Priority Date: 11/12/2008
  • Status: Abandoned Application
First Claim
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1. A substrate support useful in a reaction chamber of a plasma processing apparatus, the substrate support comprising:

  • a base member;

    a heat transfer member overlying the base member, the heat transfer member having multiple zones including at least a first zone with a first flow passage therein and a second zone with a second flow passage therein through which a liquid can be circulated to individually heat and cool the first and second zones of the heat transfer member;

    an electrostatic chuck overlying the heat transfer member, the electrostatic chuck having a support surface for supporting a substrate in a reaction chamber of the plasma processing apparatus;

    a source of cold liquid and a source of hot liquid in fluid communication with the first and second flow passages;

    a valve arrangement operable to independently control temperature of the liquid in the first and second zones by adjusting a mixing ratio of the hot liquid to the cold liquid circulating in the first and second flow passages;

    a controller controlling the valve arrangement to independently control the temperature in the first and second zones by adjusting the mixing ratio of the hot liquid to the cold liquid in the first and second flow passages.

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