INDUCTOR AND ELECTRIC POWER SUPPLY USING IT
First Claim
Patent Images
1. A printed wiring board comprising:
- a core substrate;
conductive circuits formed on top and bottom surfaces of the core substrate, respectively;
a through-hole conductor formed in the core substrate and electrically connecting the conductive circuits;
an inductor formed in the core substrate; and
a build-up layer formed on the core substrate and consisting of alternately laminated insulating layers and conductive circuits, the conductive circuits provided on different layers electrically connected each other through a via hole conductor;
wherein said inductor includes a magnetic body that extends in the thickness direction of the core substrate and that has a through-hole and a conductor provided on an inner surface of the through-hole.
0 Assignments
0 Petitions
Accused Products
Abstract
An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
30 Citations
12 Claims
-
1. A printed wiring board comprising:
-
a core substrate; conductive circuits formed on top and bottom surfaces of the core substrate, respectively; a through-hole conductor formed in the core substrate and electrically connecting the conductive circuits; an inductor formed in the core substrate; and a build-up layer formed on the core substrate and consisting of alternately laminated insulating layers and conductive circuits, the conductive circuits provided on different layers electrically connected each other through a via hole conductor; wherein said inductor includes a magnetic body that extends in the thickness direction of the core substrate and that has a through-hole and a conductor provided on an inner surface of the through-hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
Specification