Assembly of silicon parts bonded together with a silicon and silica composite

• US 20100119817A1
• Filed: 01/11/2010
• Published: 05/13/2010
• Est. Priority Date: 04/23/2003
• Status: Active Grant

• Current Assignee: Hangzhou Dunyuanjuxin Semiconductor Technology Company Limited
• Original Assignee: Integrated Materials, Inc. (Ferrotec Holdings Corporation)
• Inventors: Chalzel, Amnon, Boyle, James E., Zehavi, Raanan
• Granted Patent: US 8,268,448 B2
• Time in Patent Office: Days
• US Class Current: 428/325
• CPC Class Codes: H01L 21/67306 characterized by a material, a roughness, a coating or the like
• CPC Class Codes: Y10T 428/24174 including sheet or component perpendicular to plane of web or sheet
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/252 Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Abstract

A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size maybe formed by CVD. Larger particles maybe milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.

Claims

2-1. The assembly of claim 1, wherein the crystallites have a size distribution with at least 99% of particles of size of less than 100 nm.

6. A joined silicon assembly, comprising:

two silicon parts juxtaposed across a pair of joining areas separated by a gap; and

a composite filled into the gap, bonding the silicon parts together, and comprising

silicon particles having at least interiors consisting essentially of silicon and

a silica network in which the particles are dispersed,

wherein the parts are capable of being free-standing when not bonded together by the composite.

7. The assembly of claim 6, wherein the silicon particles have sizes of less than 100 μ

m

8. The assembly fixture of claim 6, wherein the silicon particles have at least interiors consisting essentially of silicon.

9. The assembly of claim 6, wherein the silica network is formed from a silica bridging agent which is a silicon-containing material.

10. The assembly of claim 6, wherein the silica network is formed from a silica bridging agent which is a spin-on glass.

11. The assembly of claim 6, wherein 99% of the particles have a size of less than 100 nm.

12. The assembly of claim 6, wherein the particles have size distribution with a median size in a range of 10 to 25 nm.

13. A silicon assembly comprising at least two silicon parts bonded together across respective joining areas by the method of:

providing a mixture of a powder consisting essentially of silicon and a chemical which when annealed to an annealing temperature vitrifies to form a silicate glass;

applying the mixture to at least one of the joining areas;

assembling the at least two silicon parts with the respective joining areas in juxtaposition; and

annealing the assembled parts at the annealing temperature to thereby bond the parts together.

14. The assembly of claim 13, wherein the at least two silicon parts include two silicon bases and at least three silicon legs bonded on ends thereof to the silicon bases and including teeth formed therein for supporting a plurality of substrates in a stacked arrangement.

15. The assembly of claim 13, wherein the silicon parts consist essentially of silicon.