DETECTOR WITH MOUNTING HUB TO ISOLATE TEMPERATURE INDUCED STRAIN AND METHOD OF FABRICATING THE SAME

• US 20100123072A1
• Filed: 11/17/2008
• Published: 05/20/2010
• Est. Priority Date: 11/17/2008
• Status: Active Grant

• Current Assignee: Teledyne Scientific & Imaging, LLC (Teledyne Technologies Incorporated)
• Original Assignee: Teledyne Scientific & Imaging, LLC (Teledyne Technologies Incorporated)
• Inventors: Sprafke, Thomas
• Granted Patent: US 7,795,573 B2
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00

Abstract

An imaging device and method of fabricating the same is disclosed. The imaging device may include an imaging sensor base, an image detector and a multilayer board. The imaging sensor base has a bonded hub having uniform flatness. The mounting hub sized to fit into a receptacle in the multilayer board. The image detector sized to match a size of the imaging sensor base and bonded to a top surface of the imaging sensor base. The imaging device may also include a readout integrated circuit (ROIC) sized to substantially match the size of the imaging sensor base and disposed on the image detector. A plurality of equi-spaced flexures and receptacles for receiving the plurality of flexures may also be used to maintain positional stability and minimize thermal strain.

Claims

1. An imaging device comprising:

an imaging sensor base having a mounting hub on a bottom surface, the mounting hub sized to fit into a receptacle; and

an image detector sized to substantially match a size of the imaging sensor base and bonded to a top surface of the imaging sensor base, the imaging sensor base and the image detector composed of closely matched refractory materials.

2. The imaging device of claim 1 further comprising a multilayer board having the receptacle.

3. The imaging device of claim 2, wherein the multilayer board comprises a ceramic material and alumina.

4. The imaging device of claim 1, wherein a circumference of the mounting hub comprises a plurality of equi-spaced flexure receptacles.

5. The imaging device of claim 1, wherein the imaging sensor base is fabricated from a material selected from a group consisting of molybdenum, nickel steel alloy, nickel-cobalt ferrous alloy, beryllium, alumina and aluminum nitride.

6. The imaging device of claim 1 further comprising a readout integrated circuit (ROIC) sized to substantially match the size of the imaging sensor base and disposed on the image detector.

7. An imaging device comprising:

an imaging sensor base having a top surface and a bottom surface;

an image detector sized to substantially match a size of the imaging sensor base plate and bonded to the top surface of the imaging sensor base plate, the imaging sensor base plate and the image detector composed of closely matched refractory materials; and

means for isolating temperature induced strain from the image detector.

8. The imaging device of claim 7, wherein a circumference of the mounting hub comprises a plurality of equi-spaced flexure receptacles.

9. The imaging device of claim 7, wherein the imaging sensor base plate is fabricated from a material selected from a group consisting of molybdenum, nickel steel alloy, nickel-cobalt ferrous alloy, beryllium, alumina and aluminum nitride.

10. The imaging device of claim 7 further comprising a multilayer board having the receptacle for receiving the mounting hub.

11. The imaging device of claim 10, wherein the multilayer board comprises a plurality of equi-spaced flexure receptacles.

12. The imaging device of claim 8 or 11 further comprising a plurality of equi-spaced flexures engaging the plurality of equi-spaced flexure receptacles, the plurality of equi-spaced flexure de-coupling thermally induced strain from the image detector to reduce directional deformation of the image detector.

13. A method of fabricating an imaging device comprising:

bonding an image detector to a top surface of an imaging sensor base having a mounting hub on a bottom surface, the mounting hub substantially sized to fit into a receptacle, the imaging sensor base and the image detector composed of closely matched refractory materials.

14. The method of claim 13, wherein a circumference of the mounting hub comprises a plurality of equi-spaced flexure receptacles.

15. The method of claim 13, wherein the imaging sensor base is fabricated from a material selected from a group consisting of molybdenum, nickel steel alloy, nickel-cobalt ferrous alloy, beryllium, alumina and aluminum nitride.

16. The method of claim 13 further comprising bonding the mounting hub of the imaging sensor base to a multilayer board.

17. The method of claim 13 wherein the multilayer board comprises a ceramic material and alumina.

18. A method of fabricating an imaging device having an image detector, an imaging sensor base, a multilayer board and a plurality of equi-spaced flexures, the image detector sized to substantially match a size of the imaging sensor base, the imaging sensor base having a mounting hub on a bottom surface and sized to fit into a receptacle of the multilayer board, the mounting hub and the multilayer board having a plurality of equi-spaced and opposite flexure receptacles, the method comprising:

coupling the image detector to a top surface of the imaging sensor base;

engaging the plurality of equi-spaced flexures to the plurality of equi-spaced and opposite flexure receptacles of the mounting hub and the multilayer board; and

coupling the mounting hub to the multilayer board.

19. The method of claim 18, wherein the imaging sensor base and the image detector composed of closely matched refractory materials.

20. The method of claim 18 wherein the plurality of equi-spaced flexures comprises titanium and gamma alumina.