Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
First Claim
1. A method of printing a transferable semiconductor element, said method comprising:
- a. providing an elastomeric stamp having a transfer surface with said semiconductor element supported thereon, wherein said transfer surface comprises a three-dimensional pattern of relief features that at least partially contacts said semiconductor element;
b. providing a substrate having a receiving surface;
c. establishing conformal contact between said elastomeric stamp and said receiving surface, thereby contacting at least a portion of said semiconductor element with said receiving surface;
d. offsetting said elastomeric stamp a horizontal distance relative to said receiving surface, thereby generating a mechanical deformation in at least a portion of said pattern of relief features without separating said semiconductor element from said transfer surface or said receiving surface; and
e. separating said stamp from said receiving surface, thereby printing said semiconductor element to said receiving surface.
7 Assignments
0 Petitions
Accused Products
Abstract
Provided are methods and devices for transfer printing of semiconductor elements to a receiving surface. In an aspect, the printing is by conformal contact between an elastomeric stamp inked with the semiconductor elements and a receiving surface, and during stamp removal, a shear offset is applied between the stamp and the receiving surface. The shear-offset printing process achieves high printing transfer yields with good placement accuracy. Process parameter selection during transfer printing, including time varying stamp-backing pressure application and vertical displacement, yields substantially constant delamination rates with attendant transfer printing improvement.
-
Citations
33 Claims
-
1. A method of printing a transferable semiconductor element, said method comprising:
-
a. providing an elastomeric stamp having a transfer surface with said semiconductor element supported thereon, wherein said transfer surface comprises a three-dimensional pattern of relief features that at least partially contacts said semiconductor element; b. providing a substrate having a receiving surface; c. establishing conformal contact between said elastomeric stamp and said receiving surface, thereby contacting at least a portion of said semiconductor element with said receiving surface; d. offsetting said elastomeric stamp a horizontal distance relative to said receiving surface, thereby generating a mechanical deformation in at least a portion of said pattern of relief features without separating said semiconductor element from said transfer surface or said receiving surface; and e. separating said stamp from said receiving surface, thereby printing said semiconductor element to said receiving surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A device for dry transfer printing of semiconductors to a receiving substrate, said device comprising:
-
a reinforced composite stamp comprising; a deformable layer having an internal surface and an external surface positioned opposite said internal surface, said external surface of said deformable layer having a plurality of relief features; a rigid support layer connected to said internal surface of said deformable layer, wherein said rigid support layer has a bottom surface and a top surface positioned opposite said bottom surface, wherein said bottom surface is positioned proximate to said internal surface of said deformable layer; and a reinforcement layer operably connected to said rigid support layer, said reinforcement layer having an opening that vertically coincides with at least a portion of said relief features of said external surface of said deformable layer; a mounting flange having a top surface; a vertical section that operably connects said mounting flange to said deformable layer external surface; a transfer printing tool head comprising a receiving surface that is connected to said mounting flange top surface; and an actuator operably connected to said mounting flange or said transfer printing tool head for generating a horizontal displacement between said deformable layer internal surface and said receiving surface. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
-
-
33. A method of printing a transferable semiconductor element, said method comprising:
-
a. providing a reinforced composite elastomeric stamp, said stamp having i. an elastomeric layer having a top surface and a bottom surface; ii. a transfer surface on said elastomeric layer bottom surface, wherein said semiconductor element is supported by said transfer surface and said transfer surface comprises a three-dimensional pattern of relief features that at least partially contacts said semiconductor element; iii. a rigid backing layer having a bottom surface positioned adjacent to said elastomeric layer top surface; iv. a reinforcement layer operably connected to said rigid backing layer, said reinforcement layer having an opening that vertically coincides with at least a portion of said relief features; b. providing a substrate having a receiving surface; c. positioning said transfer surface to within about 200 μ
m or less of said receiving surface;d. aligning said stamp to said receiving surface; e. establishing conformal contact between said elastomeric stamp and said receiving surface, thereby contacting at least a portion of said semiconductor element with said receiving surface by applying a uniform air pressure to said rigid backing layer; f. offsetting said elastomeric stamp a horizontal distance relative to said receiving surface, thereby generating an in-plane shear force in said stamp; g. decreasing said air pressure applied to said rigid backing layer; and h. separating said stamp from said receiving surface by moving said stamp in a vertical direction relative to said substrate, thereby printing said semiconductor element to said receiving surface.
-
Specification